Patents by Inventor Steven P. Laverde

Steven P. Laverde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Downset exposed die mount pad leadframe and package
    Patent number: 5594234
    Abstract: The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: January 14, 1997
    Assignee: Texas Instruments Incorporated
    Inventors: Buford H. Carter, Jr., Dennis D. Davis, David R. Kee, Jesse Clark, Steven P. Laverde, Hai Tran