Patents by Inventor Steven P Storm

Steven P Storm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a slotted substrate with partially patterned layers
    Patent number: 7594328
    Abstract: A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: September 29, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith, Tony Cruz-Uribe
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Patent number: 6945634
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: September 20, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Publication number: 20040067319
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 8, 2004
    Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Patent number: 6648732
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: November 18, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto A. Pugliese, Jr., Mark H. MacKenzie, Thomas E Pettit, Victorio A. Chavarria, Steven P Storm, Allen H Smith
  • Thin film coating of a slotted substrate and techniques for forming slotted substrates
    Publication number: 20020102918
    Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Roberto A. Pugliese, Mark H. MacKenzie, Thomas E. Pettit, Victorio A. Chavarria, Steven P. Storm, Allen H. Smith