Abstract: In one embodiment, a computer-implemented method includes issuing, to a DRAM with EIP, a first group of two or more load requests to load data from a hash table constructed from hashed join-key values of a dimension table for a hash-join procedure. A second group of two or more load requests is issued. First response data is received, responsive to the first group of load requests. The first response data is processed while awaiting second response data responsive to the second group. Processing the first response data includes identifying matches between the join-key values corresponding to entries in the load requests of the first group and one or more hash buckets in the first response data. The size of the second group of load requests is selected such that a time for processing the first response data is approximately equal to the latency in receiving the second response data.

Abstract: In one embodiment, a computer-implemented method includes issuing, to a DRAM with EIP, a first group of two or more load requests to load data from a hash table constructed from hashed join-key values of a dimension table for a hash-join procedure. A second group of two or more load requests is issued. First response data is received, responsive to the first group of load requests. The first response data is processed while awaiting second response data responsive to the second group. Processing the first response data includes identifying matches between the join-key values corresponding to entries in the load requests of the first group and one or more hash buckets in the first response data. The size of the second group of load requests is selected such that a time for processing the first response data is approximately equal to the latency in receiving the second response data.

Abstract: In one embodiment, a computer-implemented method includes issuing, to a DRAM with EIP, a first group of two or more load requests to load data from a hash table constructed from hashed join-key values of a dimension table for a hash-join procedure. A second group of two or more load requests is issued. First response data is received, responsive to the first group of load requests. The first response data is processed while awaiting second response data responsive to the second group. Processing the first response data includes identifying matches between the join-key values corresponding to entries in the load requests of the first group and one or more hash buckets in the first response data. The size of the second group of load requests is selected such that a time for processing the first response data is approximately equal to the latency in receiving the second response data.

Abstract: In one embodiment, a computer-implemented method includes issuing, to a DRAM with EIP, a first group of two or more load requests to load data from a hash table constructed from hashed join-key values of a dimension table for a hash-join procedure. A second group of two or more load requests is issued. First response data is received, responsive to the first group of load requests. The first response data is processed while awaiting second response data responsive to the second group. Processing the first response data includes identifying matches between the join-key values corresponding to entries in the load requests of the first group and one or more hash buckets in the first response data. The size of the second group of load requests is selected such that a time for processing the first response data is approximately equal to the latency in receiving the second response data.

Abstract: Mechanisms for providing an interconnect layer of a three-dimensional integrated circuit device having multiple independent and cooperative on-chip networks are provided. With regard to an apparatus implementing the interconnect layer, such an apparatus comprises a first integrated circuit layer comprising one or more first functional units and an interconnect layer coupled to the first integrated circuit layer. The first integrated circuit layer and interconnect layer are integrated with one another into a single three-dimensional integrated circuit. The interconnect layer comprises a plurality of independent on-chip communication networks that are independently operable and independently able to be powered on and off, each on-chip communication network comprising a plurality of point-to-point communication links coupled together by a plurality of connection points. The one or more first functional units are coupled to a first independent on-chip communication network of the interconnect layer.

Abstract: A first cache simultaneously broadcasts, in a single message, a request for a cache line and a request to accept a future related evicted cache line to multiple other caches. Each of the multiple other caches evaluate their occupancy to derive an occupancy value that reflects their ability to accept the future related evicted cache line. In response to receiving a requested cache line, the first cache evicts the related evicted cache line to the cache with the highest occupancy value.

Abstract: A circuit arrangement and method in one aspect utilize thermal-only through vias, extending between the opposing faces of stacked semiconductor dies, to increase the thermal conductivity of a multi-layer semiconductor stack. The thermal vias are provided in addition to data-carrying through vias, which communicate data signals between circuit layers, and power-carrying through vias, which are coupled to a power distribution network for the circuit layers, such that the thermal conductivity is increased above that which may be provided by the data-carrying and power-carrying through vias in the stack. A circuit arrangement and method in another aspect organize the circuit layers in a multi-layer semiconductor stack based upon current density so as to reduce power distribution losses in the stack.

Abstract: Mechanisms for providing an interconnect layer of a three-dimensional integrated circuit device having multiple independent and cooperative on-chip networks are provided. With regard to an apparatus implementing the interconnect layer, such an apparatus comprises a first integrated circuit layer comprising one or more first functional units and an interconnect layer coupled to the first integrated circuit layer. The first integrated circuit layer and interconnect layer are integrated with one another into a single three-dimensional integrated circuit. The interconnect layer comprises a plurality of independent on-chip communication networks that are independently operable and independently able to be powered on and off, each on-chip communication network comprising a plurality of point-to-point communication links coupled together by a plurality of connection points. The one or more first functional units are coupled to a first independent on-chip communication network of the interconnect layer.

Abstract: A first cache simultaneously broadcasts, in a single message, a request for a cache line and a request to accept a future related evicted cache line to multiple other caches. Each of the multiple other caches evaluate their occupancy to derive an occupancy value that reflects their ability to accept the future related evicted cache line. In response to receiving a requested cache line, the first cache evicts the related evicted cache line to the cache with the highest occupancy value.

Abstract: Exemplary embodiments include a method for updating an Cache LRU tree including: receiving a new cache line; traversing the Cache LRU tree, the Cache LRU tree including a plurality of nodes; biasing a selection the victim line toward those lines with relatively low priorities from the plurality of lines; and replacing a cache line with a relatively low priority with the new cache line.

Abstract: A system for employing a scalable distributed arbitration scheme, including: a plurality of stations interconnected via a ring topology for transferring data between the plurality of stations; and a bus coupling the plurality of stations in the ring topology; wherein each of the plurality of stations on the topology ring is permitted to independently make a decision when to load their data on the topology ring by evaluating a set of inputs.

Abstract: Exemplary embodiments include a method for updating an Cache LRU tree including: receiving a new cache line; traversing the Cache LRU tree, the Cache LRU tree including a plurality of nodes; biasing a selection the victim line toward those lines with relatively low priorities from the plurality of lines; and replacing a cache line with a relatively low priority with the new cache line.