Patents by Inventor Steven Patrick Cardinali

Steven Patrick Cardinali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-profile space-efficient shielding for SIP module
    Patent number: 10624214
    Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: April 14, 2020
    Assignee: Apple Inc.
    Inventors: Amir Salehi, Takayoshi Katahira, Vu T. Vo, Wyeman Chen, Chang Liu, Dennis R. Pyper, Steven Patrick Cardinali, Lan Hoang, Siddharth Nangia, Meng Chi Lee
  • LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE
    Publication number: 20160270213
    Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
    Type: Application
    Filed: February 11, 2016
    Publication date: September 15, 2016
    Applicant: Apple Inc.
    Inventors: Amir Salehi, Vu T. Vo, Wyeman Chen, Chang Liu, Dennis R. Pyper, Steven Patrick Cardinali, Lan Hoang, Siddharth Nangia, Meng Chi Lee, Takayoshi Katahira