Patents by Inventor Steven Paul Ostrander
Steven Paul Ostrander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11882645Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.Type: GrantFiled: October 22, 2021Date of Patent: January 23, 2024Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, James Busby, Philipp K Buchling Rego, Steven Paul Ostrander, Thomas Anthony Wassick, William Santiago-Fernandez, Nihad Hadzic
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Publication number: 20230130104Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.Type: ApplicationFiled: October 22, 2021Publication date: April 27, 2023Inventors: Sushumna Iruvanti, James Busby, Philipp K. Buchling Rego, Steven Paul Ostrander, Thomas Anthony Wassick, William Santiago-Fernandez, Nihad Hadzic
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Publication number: 20220308564Abstract: Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.Type: ApplicationFiled: March 23, 2021Publication date: September 29, 2022Inventors: Kirk D. Peterson, Steven Paul Ostrander, Stephanie E Allard, Charles L. Reynolds, Sungjun Chun, Daniel M. Dreps, Brian W. Quinlan, Sylvain Pharand, Jon Alfred Casey, David Edward Turnbull, Pascale Gagnon, Jean Labonte, Jean-Francois Bachand, Denis Blanchard
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Patent number: 11308257Abstract: A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants.Type: GrantFiled: December 15, 2020Date of Patent: April 19, 2022Assignee: International Business Machines CorporationInventors: Dureseti Chidambarrao, David Wolpert, Atsushi Ogino, Matthew T. Guzowski, Steven Paul Ostrander, Tuhin Sinha, Michael Stewart Gray
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Patent number: 11239183Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.Type: GrantFiled: January 31, 2020Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles Leon Arvin, Steven Paul Ostrander, Thomas Weiss
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Publication number: 20210242139Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.Type: ApplicationFiled: January 31, 2020Publication date: August 5, 2021Inventors: Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles Leon Arvin, Steven Paul Ostrander, Thomas Weiss
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Patent number: 8085550Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.Type: GrantFiled: March 24, 2009Date of Patent: December 27, 2011Assignee: International Business Machines CorporationInventors: Mark Kenneth Hoffmeyer, Steven Paul Ostrander, Sri M. Sri-Jayantha
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Publication number: 20100248506Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.Type: ApplicationFiled: March 24, 2009Publication date: September 30, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mark Kenneth Hoffmeyer, Steven Paul Ostrander, Sri M. Sri-Jayantha
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Patent number: 6502999Abstract: An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.Type: GrantFiled: September 4, 2001Date of Patent: January 7, 2003Assignee: JDS Uniphase CorporationInventors: Mitchell Simmons Cohen, David Peter Gaio, William K. Hogan, Steven Paul Ostrander, Sudipta Kumar Ray, Jeannine Madelyn Trewhella
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Patent number: 6197222Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.Type: GrantFiled: July 20, 1998Date of Patent: March 6, 2001Assignee: International Business Machines CorporationInventors: Ravi F. Saraf, Judith Marie Roldan, Michael Anthony Gaynes, Richard Benton Booth, Steven Paul Ostrander, Emanuel I. Cooper, Carlos J. Sambucetti
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Patent number: 5866044Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.Type: GrantFiled: October 21, 1996Date of Patent: February 2, 1999Assignee: International Business MachinesInventors: Ravi F. Saraf, Judith Marie Roldan, Michael Anthony Gaynes, Richard Benton Booth, Steven Paul Ostrander, Emanuel I. Cooper, Carlos J. Sambucetti
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Patent number: 5813870Abstract: Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.Type: GrantFiled: July 12, 1996Date of Patent: September 29, 1998Assignee: International Business Machines CorporationInventors: Michael Anthony Gaynes, Jaynal Abedin Molla, Steven Paul Ostrander, Judith Marie Roldan, George John Saxenmeyer, George Frederick Walker