Patents by Inventor Steven Paul Ostrander

Steven Paul Ostrander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8085550
    Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: December 27, 2011
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Steven Paul Ostrander, Sri M. Sri-Jayantha
  • Publication number: 20100248506
    Abstract: A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 30, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark Kenneth Hoffmeyer, Steven Paul Ostrander, Sri M. Sri-Jayantha
  • Patent number: 6502999
    Abstract: An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: January 7, 2003
    Assignee: JDS Uniphase Corporation
    Inventors: Mitchell Simmons Cohen, David Peter Gaio, William K. Hogan, Steven Paul Ostrander, Sudipta Kumar Ray, Jeannine Madelyn Trewhella
  • Patent number: 6197222
    Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
    Type: Grant
    Filed: July 20, 1998
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Ravi F. Saraf, Judith Marie Roldan, Michael Anthony Gaynes, Richard Benton Booth, Steven Paul Ostrander, Emanuel I. Cooper, Carlos J. Sambucetti
  • Patent number: 5866044
    Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: February 2, 1999
    Assignee: International Business Machines
    Inventors: Ravi F. Saraf, Judith Marie Roldan, Michael Anthony Gaynes, Richard Benton Booth, Steven Paul Ostrander, Emanuel I. Cooper, Carlos J. Sambucetti
  • Patent number: 5813870
    Abstract: Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: September 29, 1998
    Assignee: International Business Machines Corporation
    Inventors: Michael Anthony Gaynes, Jaynal Abedin Molla, Steven Paul Ostrander, Judith Marie Roldan, George John Saxenmeyer, George Frederick Walker