Abstract: A vertical axis wind turbine including a blade having a modular structure, comprising at least two connectable blade sections. Each section has an upper and lower panel with a cavity formed therebetween through which extends a spar.

Abstract: A vertical axis wind turbine including a blade having a modular structure, comprising at least two connectable blade sections. Each section has an upper and lower panel with a cavity formed therebetween through which extends a spar.

Abstract: A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.

Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral-margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Abstract: A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Abstract: An improved retractable umbrella including a canopy, a plurality of extending arms for supporting the canopy, an outer housing having an interior cavity for housing the canopy and the plurality of extending arms, and a collapsing mechanism for pivoting the plurality of extending arms upwardly into a substantially vertical position from an open configuration to collapse the canopy upwardly into an inverted closed configuration thereby allowing retraction of the canopy and the plurality of extending arms into the interior cavity of the outer housing. In one embodiment, the retractable umbrella also includes a displaceable member positioned in the interior cavity of the outer housing and a center shaft extending into the interior cavity and being displaceable therewithin from outside of the outer housing. The displaceable member has a central opening through which the center shaft extends.