Abstract: The present invention involves a method and apparatus for sequencing leadless and leaded surface mountable components, feeding them directly from a sequencer to chip placement heads, and placing them at selected locations on a circuit board. The chip carriers of an endless chain conveyor carry each component of the sequence of components to a chip placement head. Direct supply from a sequencer having the chip carriers and a series of individual programmably controlled dispenser heads provides for quick and flexible variation of the input sequence without manual intervention. A plurality of the chip placement heads are mounted on a turret assembly to facilitate continuous unloading of the chip carriers and orienting, centering, and squaring of the components prior to placement on a circuit board.