Patents by Inventor Steven R. Burkhart

Steven R. Burkhart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic device structure utilizing a diamond inlay in a package flange
    Patent number: 6489634
    Abstract: A microelectronic device structure includes a package flange with a body having a body upper surface, a substantially circular body interior sidewall defining an opening in the body upper surface, and a substantially circular inlay made of CVD diamond. The inlay is received into the substantially circular opening and has an inlay exterior sidewall which is adjacent to the body interior sidewall and is brazed thereto. The inlay has an inlay upper surface that is substantially coplanar with the body upper surface. A microelectronic device is affixed to the inlay upper surface.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: December 3, 2002
    Assignee: The Boeing Company
    Inventors: Christopher Schaffer, Steven R. Burkhart, Bartley J. Price