Abstract: An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board.

Abstract: An information handling resource may include a circuit board comprising an electrically-conductive pad and a plated standoff plated onto a surface of the electrically-conductive pad.

Abstract: A method for forming a circuit board may include, in a conductive layer of the circuit board, applying a layer of metal foil to a first insulating layer of the circuit board, selectively plating the layer of metal with additional metal, removing portions of the layer of metal foil such that the selectively plating and removing steps create a plurality of conductive traces including a first conductive trace and a second conductive trace within a conductive layer of the circuit board, wherein a first thickness of the first conductive trace from a surface of the first insulating layer is different than a second thickness of the second conductive trace from the surface, and laminating a second insulating layer over the conductive layer.

Abstract: An information handling resource may include a circuit board comprising an electrically-conductive pad, a circuit package comprising an electrically-conductive pin, and reflowed solder electrically coupling the electrically-conductive pad to the electrically-conductive pin, the reflowed solder having embedded therein at least one bead configured to provide mechanical standoff between the pad and the pin.

Abstract: In one or more embodiments, a coupon with a plurality of cutouts based on a chirp waveform may be used to align a drilling machine to a PCB. Light may be passed through the coupon and a camera may capture the light. A processor may perform zero padding, calculate a two-dimensional (2D) fast Fourier transform (FFT) of the image, multiply by a pre-calculated complex conjugate 2D FFT of the coupon, then calculate a cross correlation based on an inverse 2D FFT. Embodiments may find the best fitting coordinates of the peaks and use the coordinate as a correction factor for referencing a drilling machine to ensure drills are centered and/or aligned relative to power plane pads or antipads.

Abstract: A method may include slicing a circuit board at multiple parallel cross-sections of the circuit board, each slice of the circuit board taken in a respective slice plane substantially non-perpendicular and substantially non-parallel to a surface of the circuit board.

Abstract: A circuit board may include at least one layer of resin and a plurality of microparticles distributed throughout the at least one layer of resin.

Abstract: A circuit board may include a plurality of electrically-conductive layers and a plurality of electrically-insulative layers laminated together with the plurality of electrically-conductive layers such that each of the plurality of electrically-insulative layers is located between adjacent layers of the plurality of electrically-conductive layers. A first electrically-conductive layer of the plurality of electrically-conductive layers may be patterned, during a process step in the manufacture of the circuit board, to include an electrically-conductive pattern patterned to be electrically coupled to an electrically-conductive network within the circuit board and a nonfunctional pad comprising a portion of conductive material patterned from the first electrically-conductive layer but electrically decoupled from the electrically-conductive pattern.

Abstract: An adhesive tape may include a first adhesive strip having an adhesive material applied to the first adhesive strip on a first side of the adhesive tape, a second adhesive strip having the adhesive material applied to the second adhesive strip on the first side of the adhesive tape, the second adhesive strip substantially parallel with the first adhesive strip and separated from the first adhesive strip by a distance, and a non-adhesive region between the first adhesive strip and the second adhesive strip wherein the non-adhesive region is substantially free of adhesive on the first side of the adhesive tape.

Abstract: A method for processing a circuit board may include making an angled cut on an edge of the circuit board between a first surface and a second surface of the circuit board to form a bevel on the edge such that the first surface and the angled cut form an obtuse angle and the second surface and the angled cut form an acute angle.