Abstract: A chip-on-board electronic device includes an electronic device die affixed to a printed circuit board, and electrically interconnected thereto by wirebonds. The electronic device is protected by coating it with a layer of silicon oxynitride and, optionally, an overlying thin layer of a conformal coating such as parylene. Under some circumstances, a protective layer of an organic material may be used instead of the layer of silicon oxynitride. The chip-on-board electronic device may be protected with an overlying layer of the conformal coating.

Abstract: Predetermined desired areas of solvent-insoluble parylene coatings are removed from substrates made of materials such as plastics, metals, composites, or ceramics by contacting the areas to be removed with a substance that causes the parylene coating to loosen from the substrate sufficiently to permit physical removal, as by peeling or scraping. The substance used is tetrahydrofuran alone, or in combination with a carrier that does not react with the tetrahydrofuran, the parylene, or the substrate, and that makes the mixture sufficiently viscous for application to desired coating areas without affecting other areas contiguous thereto.

Abstract: A coated paperboard product and a process for producing the same which includes corona discharge treatment of a paperboard surface and subsequent extrusion of molten polyester thereon. The resulting product has a very high degree of adhesion between the paperboard and polyester layers, and is capable of being utilized for forming pressed food trays which can be subjected to oven cooking temperatures.