Patents by Inventor Steven R Geissler

Steven R Geissler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid ejector structure and fabrication method
    Patent number: 8109607
    Abstract: In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: February 7, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Martha A Truninger, Michael Monroe, Steven R Geissler
  • Wafer packaging and singulation method
    Patent number: 7682934
    Abstract: A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: March 23, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Steven R. Geissler
  • Fluid Ejector Structure and Fabrication Method
    Publication number: 20090225131
    Abstract: In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.
    Type: Application
    Filed: September 5, 2008
    Publication date: September 10, 2009
    Inventors: Chien-Hua Chen, Martha A. Truninger, Michael Monroe, Steven R. Geissler
  • Method of singulating electronic devices
    Patent number: 7422962
    Abstract: A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid street is disposed over the bond pad. In addition, the method also includes sawing partially through the lid street to form a trench in the lid street. The trench includes a trench bottom in the lid substrate.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: September 9, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Zhizhang Chen, Steven R Geissler