Patents by Inventor Steven R. Hahn

Steven R. Hahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6842345
    Abstract: A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: January 11, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
  • Patent number: 6757179
    Abstract: A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: June 29, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
  • Patent number: 6744632
    Abstract: The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: June 1, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeremy I. Wilson, Todd D. Robertus, Steven R. Hahn, Michael A. Brooks
  • Publication number: 20040057210
    Abstract: The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.
    Type: Application
    Filed: September 20, 2002
    Publication date: March 25, 2004
    Inventors: Jeremy I. Wilson, Todd D. Robertus, Steven R. Hahn, Michael A. Brooks
  • Patent number: 6707675
    Abstract: Disclosed herein are electromagnetic interference ‘EMI’ containment devices and methods for abating interference generated by electronic devices.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 16, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Steven R. Hahn, Jeremy I. Wilson, Thomas J. Augustin, Todd D. Robertus
  • Publication number: 20040042182
    Abstract: A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.
    Type: Application
    Filed: August 29, 2002
    Publication date: March 4, 2004
    Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
  • Publication number: 20040042162
    Abstract: A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.
    Type: Application
    Filed: August 29, 2002
    Publication date: March 4, 2004
    Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
  • Patent number: 4314264
    Abstract: An ink supply system for supplying ink through the print head of an ink jet printer includes a pump arrangement supplying ink to the print head from a supply tank and, further, plural ink return lines connected between the pump outlet and the pump inlet. Each of the ink return lines includes a flow restriction, with the flow restriction in each line providing a fluid flow impedance which differs from the impedances provided by the other flow restrictions. A valve arrangement controls the connection of the pump outlet to a selected one of the ink return lines, such that the flow rate of ink through the ink supply line to the print head is effectively controlled.
    Type: Grant
    Filed: August 15, 1980
    Date of Patent: February 2, 1982
    Assignee: The Mead Corporation
    Inventors: Dennis E. Bok, Mark E. Brown, Steven R. Hahn, David A. Huliba, Thomas M. Wysinski