Abstract: A power conversion system and methods of power conversion and construction of such a system are disclosed, where the system includes at least two pairs of input and output bus bars, and two pairs of switching devices, with the switching devices of each respective pair coupled in parallel in between a respective pair of the bus bars. When one of the switching devices of each pair is closed, the bus bars of the respective pair of bus bars are short-circuited to one another, thus bypassing the other of the switching devices of each pair. The other of the switching devices of each pair is attached to at least one intermediate portion, which in turn is attached to a mass. Substantially all the heat generated by the other of the switching devices of each pair is communicated to the mass, which has a heat capacity capable of receiving that heat.

Abstract: An electronic device/heat sink assembly having at least first and second heat generating electronic devices, a heat sink member, a resilient integral spring clip, the clip including a base member and first and second oppositely facing resilient leg members extending from opposite ends of the base member, the heat sink member having oppositely facing first and second surfaces, a separate one of the electronic devices positioned on each of the first and second sink surfaces, the clip dimensioned and positioned such that the leg members sandwich the devices and heat sink therebetween.

Abstract: A network system is provided for transmitting electrical power and data signals between a plurality of device nodes. The system includes a trunk cable in which a pair of dedicated power conductors and a pair of dedicated signal conductors are embedded in an insulative cover. Modular connectors are electrically coupled to the cable conductors at each device node. Each connector includes a base module and an interface module. The base module is attached to the cable via insulation piercing members and thereafter remains resident on the cable. The interface module is mated with the base module and serves to transmit power and data signals between the base module and a networked device. Several types of interface modules may be utilized interchangeably to permit the base module and cable to accommodate various types of devices and device drop cables.

Abstract: A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM.TM. interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.

Abstract: A rigid-flex multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single flexible circuit board layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single flexible circuit board layer is less than 2.0 mils thick and includes polyimide. The single flexible circuit board layer provides a heat conductive yet highly electrically insulative mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting area eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.