Abstract: Semiconductor devices may include a substrate and a semiconductor die on the substrate. The semiconductor die may include an active surface and a lateral edge at a periphery of the active surface. An electrically insulating material may be located on the active surface proximate the lateral edge. The electrically insulating material may be distinct from any other material located on the active surface. A wire bond may extend from the active surface, over the electrically insulating material, to the substrate. Methods of making semiconductor devices may involve positioning an electrically insulating material on an active surface of a semiconductor die proximate a lateral edge at a periphery of an active surface. After positioning the electrically insulating material on the active surface, a wire bond extending from the active surface, over the electrically insulating material, to the substrate may be formed.

Abstract: Semiconductor devices may include a substrate and a semiconductor die on the substrate. The semiconductor die may include an active surface and a lateral edge at a periphery of the active surface. An electrically insulating material may be located on the active surface proximate the lateral edge. The electrically insulating material may be distinct from any other material located on the active surface. A wire bond may extend from the active surface, over the electrically insulating material, to the substrate. Methods of making semiconductor devices may involve positioning an electrically insulating material on an active surface of a semiconductor die proximate a lateral edge at a periphery of an active surface. After positioning the electrically insulating material on the active surface, a wire bond extending from the active surface, over the electrically insulating material, to the substrate may be formed.

Abstract: A surgical instrument comprises a handle having a blade proximate a distal end of the handle. A blade edge inset from a mouth of the recess is exposed within the recess and faces at least partially toward a proximal end of the handle with the blade edge inset from a mouth of the recess. The distal end further comprises a point bounding a portion of the recess and facing at least partially toward the proximal end of the handle. Methods of use are also disclosed.

Abstract: A surgical instrument comprises a handle having a blade proximate a distal end of the handle. A blade edge inset from a mouth of the recess is exposed within the recess and faces at least partially toward a proximal end of the handle with the blade edge inset from a mouth of the recess. The distal end further comprises a point bounding a portion of the recess and facing at least partially toward the proximal end of the handle. Methods of use are also disclosed.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

Abstract: A privacy-enhancing, glare-reducing display screen shield is provided including a pleated central portion, a first leg and a second leg on the edges of the pleated portion and generally parallel to the pleats, and mounting means on at least one leg to enable the display screen shield to be attached to an electronic device. The legs are movable relative to each other between a closed position and an open position in which the pleats radiate outwardly in a fan configuration, thus enabling the collapsible, transportable, attachable, and removable design of the display screen shield. The mounting means include adhesives, hook and loop fasteners, magnets, complementary mechanical means, or other removable means. Optionally, leg attachment bases that incorporate complementary mounting means and that attach to the electronic device may be provided. One or more display screen shields can be attached to the electronic device to furnish privacy or glare reduction.

Abstract: An optical measuring device having multiple optical paths between one or more light emitters and one or more light detectors and/or providing at least two sets of wavelength of light along at least one path, with a final measurement being produced as a combination of measurements of the sets of wavelengths of light taken along one or more of the optical paths.

Abstract: A multiple channel programmable gamma correction voltage generator including a resistor ladder, buffers, select logic, and a programmable non-volatile memory device. The memory provides select values indicative of one or more stored gamma correction values. The resistor ladder includes adjustable tap resistors distributed along the resistor ladder. The adjustable tap resistors provide multiple tap voltages distributed according to the gamma correction value. The buffers receive the tap voltages and provide gamma correction voltages. The select logic selects tap points of the adjustable tap resistors to select the tap voltages based on the select values stored in the memory. Additional resistors and switch logic may be included to enable re-positioning of the adjustable tap resistor within the resistor ladder. Latches and address control may be provided on the memory to enable programming and selection of multiple gamma correction values.

Abstract: A fetal heart rate electrode assembly, a connector for use therewith and a cable assembly including a housing assembly configured for engagement with the connector. The electrode assembly includes a drive knob configured and located for selective extension of a fetal scalp electrode beyond a distal end thereof. The connector comprises a rotationally omnidirectional contact assembly disposed within a dielectric housing including an annular groove on the exterior thereof The housing assembly includes longitudinally resiliently biased pin contacts for end face contact with the contacts of the connector disposed within an inner housing of the housing assembly having an O-ring and an annular retention element positioned to respectively wipe the exterior of the connector housing and grasp the connector housing at the annular groove when the connector is inserted thereinto. A system and methods of use are also disclosed.

Abstract: A lifting mechanism for track-type vehicles has a rectangular, elongated base skid onto which at least three separately adjustable lifts are positioned. A first lift is positioned at the forward end of the skid and includes a crossbar extending between the elongated sides of the skid. A telescoping, hydraulic jack is positioned at each end of the crossbar, which jacks can be extended to lift the crossbar into engagement with the lower side of a vehicle. Positionable lifting devices are also located along opposing, elongated sides of the skid. Each lifting device is a telescoping hydraulic jack carried at one end of a telescoping arm. The arm is pivotally mounted to the skid at the other end of the arm. The arm's telescopic length and rotational position can be adjusted as necessary to position the lifting device attached thereto as desired under a vehicle.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

Abstract: A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member rigidities the package, and is dimensioned such that the outer member has substantially equal volumes of molding compound on either side of the leadframe. The equal volumes of molding compound reduce thermo-mechanical stresses generated during cooling of the molding compound, and reduce package bow. With reduced package bow, a planarity of the terminal leads on the package is maintained. Also, stresses on bonded connections between the terminal leads and electrodes on a supporting substrate, such as a printed circuit board or multi chip module substrate are reduced.

Abstract: The G/G genotype of a Single Nucleotide Polymorphism (SNP) in the promoter of the human resistin gene, −180C>G, singificantly increased basal promoter activity in adipocytes. These data were recapitulated in vivo where G/G homozygotes had significantly higher resistin mRNA levels in human abdominal subcutaneous fat. A significant interaction was also found between the −180C>G SNP, a marker of oxidative stress and insulin resistance. In addition, resistin mRNA was positively and independently correlated with insulin resistance and hepatic fat as measured by liver X-ray attenuation. These data implicate resistin in the pathophysiology of the human insulin resistance syndrome, an effect mediated by the −180C>G promoter SNP and cellular oxidative stress. The −180C>G SNP may be used to identify insulin-resistant individuals responsive to anti-oxidant therapy, including treatment with anti-oxidant vitamins (e.g. vitamin C, vitamin E, etc.), supplements (e.g.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

Abstract: A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member rigidities the package, and is dimensioned such that the outer member has substantially equal volumes of molding compound on either side of the leadframe. The equal volumes of molding compound reduce thermo-mechanical stresses generated during cooling of the molding compound, and reduce package bow. With reduced package bow, a planarity of the terminal leads on the package is maintained. Also, stresses on bonded connections between the terminal leads and electrodes on a supporting substrate, such as a printed circuit board or multi chip module substrate are reduced.

Abstract: A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member rigidities the package, and is dimensioned such that the outer member has substantially equal volumes of molding compound on either side of the leadframe. The equal volumes of molding compound reduce thermo-mechanical stresses generated during cooling of the molding compound, and reduce package bow. With reduced package bow, a planarity of the terminal leads on the package is maintained. Also, stresses on bonded connections between the terminal leads and electrodes on a supporting substrate, such as a printed circuit board or multi chip module substrate are reduced.

Abstract: A fuel injection pump system specifically designed to provide a variety of fuels, including aviation kerosene-jet fuel, arctic fuels and diesel fuels to a single cylinder compression ignited engine using a single bore fuel injection pump and governor in a single housing. The fuel injection pump system includes a housing enclosing a fuel injection pump with governor system which is attached directly to the engine casing. thereby using the engine's oil for lubrication of the fuel injection pump. The internally attached governor system enables the engine to idle smoothly at a predetermined speed and also provide high-speed protection by reducing fuel at predetermined RPM settings. A uniquely designed plunger and barrel in the fuel injection pump incorporates an anti-knock helix shaped plunger that changes the idle injection timing for sound attenuation.

Abstract: A fuel injection pump system specifically designed to provide a variety of fuels, including aviation kerosene-jet fuel, arctic fuels and diesel fuels to a single cylinder compression ignited engine using a single bore fuel injection pump and governor in a single housing. The fuel injection pump system includes a housing enclosing a fuel injection pump with governor system which is attached directly to the engine casing thereby using the engine's oil for lubrication of the fuel injection pump. The internally attached governor system enables the engine to idle smoothly at a predetermined speed and also provide high-speed protection by reducing fuel at predetermined RPM settings. A uniquely designed plunger and barrel in the fuel injection pump incorporates an anti-knock helix shaped plunger that changes the idle injection timing for sound attenuation.

Abstract: A urodynamic catheter incorporating at least one balloon adjacent a distal end thereof and associated with a pressure lumen extending to a proximal end to be placed external to the body of a patient and usable with a transducer housing including a pressure transducer and a mechanism for alternatively venting an air column defined by the assembled pressure lumen and transducer housing to the ambient environment and closing the air column and charging it with air while reducing volume of the air column. One embodiment includes two, separately-chargeable balloons and a bladder fill tube, another embodiment includes a single balloon and a fill tube, and yet another embodiment, suitable for use as a reference catheter to measure abdominal pressure, includes only a single balloon and omits the fill tube. A novel catheter architecture and assembly technique are also disclosed, as are methods of using the inventive catheter.

Abstract: A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member encapsulating the molded inner member. The inner member rigidities the package, and is dimensioned such that the outer member has substantially equal volumes of molding compound on either side of the leadframe. The equal volumes of molding compound reduce thermo-mechanical stresses generated during cooling of the molding compound, and reduce package bow. With reduced package bow, a planarity of the terminal leads on the package is maintained. Also, stresses on bonded connections between the terminal leads and electrodes on a supporting substrate, such as a printed circuit board or multi chip module substrate are reduced.