Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the thermal pad and a portion of the first mold compound in a die mounting area in the recess; a semiconductor die mounted to the thermal pad and another semiconductor die mounted to the mold compound in the die mounting area; wire bonds coupling bond pads on the semiconductor dies to traces on the pre-molded package substrate; and a second mold compound over the die side surface of the pre-molded package substrate and covering the wire bonds, the semiconductor dies, the recess, and a portion of the traces.

Abstract: An embodiment of the invention provides a method for providing power to a USB client device and polling for a correct protocol. A USB host device provides power and a first part of a first handshake determined by a first protocol. The host then monitors the client for a second part of the first handshake. When the second part of the first handshake is detected by the host, the client recognizes that power may be applied according to the first protocol. When the second part of the first handshake is not presented by the client device, the host provides a first part of a second handshake according to a second protocol. When the second part of the second handshake is provided by the client, the host the client recognizes that power may be applied according to the second protocol.

Abstract: An embodiment of the invention provides a method for continuously detecting when a USB client device may be charged according to a BCS charging standard. Power is supplied from a USB host device to the USB client device with a first current limit. Next, the USB host device monitors data lines D+ and D? for a first part of a handshake. When the first part of the handshake is detected, a second part of the handshake is provided by the USB host device indicating that the USB client device may be changed according to the BCS charging standard. All current sources and all voltage sources that are coupled to the data lines D+ and D? are decoupled from data lines D+ and D? after the handshake is complete. After the data lines are decoupled, communication may begin between the USB host device and the USB client device.

Abstract: An embodiment of the invention provides a method for continuously detecting when a USB client device may be charged according to a BCS charging standard. Power is supplied from a USB host device to the USB client device with a first current limit. Next, the USB host device monitors data lines D+ and D? for a first part of a handshake. When the first part of the handshake is detected, a second part of the handshake is provided by the USB host device indicating that the USB client device may be changed according to the BCS charging standard. All current sources and all voltage sources that are coupled to the data lines D+ and D? are decoupled from data lines D+ and D? after the handshake is complete. After the data lines are decoupled, communication may begin between the USB host device and the USB client device.

Abstract: An embodiment of the invention provides a method for providing power to a USB client device and polling for a correct protocol. A USB host device provides power and a first part of a first handshake determined by a first protocol. The host then monitors the client for a second part of the first handshake. When the second part of the first handshake is detected by the host, the client recognizes that power may be applied according to the first protocol. When the second part of the first handshake is not presented by the client device, the host provides a first part of a second handshake according to a second protocol. When the second part of the second handshake is provided by the client, the host the client recognizes that power may be applied according to the second protocol.