Abstract: A solder ball placement system including a singulation unit and bond head for delivery of solder balls to a chip or substrate is disclosed. The bond head includes a tool tip configured to conduct electricity at a rate sufficient to prevent charge buildup but not at so high a rate as to overload a device being bonded to the substrate or chip.

Abstract: The present invention provides for placement of an LED device on a carrier through the use of a pick-and-place tool. The tool conducts electricity at a rate sufficient to prevent charge buildup but not at so high a rate as to overload the LED being placed.

Abstract: Bonding tool tips and wedge tools for bonding electrical connections are disclosed herein. The tool tips have 102 to 105 ohms of resistance and the wedge bonding tools have a range of 1012 to 1019 ohms of resistance. A resistive material coating the tool tip and wedge tool has a resistance low enough to discharge a voltage in a device being bonded and high enough to avoid current flow large enough to damage the device being bonded.

Abstract: A bonding tool for use in multi-head tape automated bonding (TAB) is provided. The bonding tool comprises a plurality of TAB bonding heads, the TAB bonding heads providing for electrical dissipation wherein current flow is low enough so as not to damage a device being bonded and high enough to avoid the build up of a charge that may discharge to the device being bonded.

Abstract: A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.

Abstract: A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for manufacturing a dissipative material for use in a flip chip bonding tool tip are further disclosed.

Abstract: A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed.

Abstract: The present invention is a method and device for removing radon from groundwater without substantially reducing wellhead pressure. The pressurized radon stripper of the present invention has two principal components: a novel Venturi injector assembly which introduces air into a water process stream from a water source such as a well or the like; and a packed bed contactor which enhances air-liquid contact and serves as a gas-liquid separator. Over two thirds of the radon removal occurs in the Venturi injectors due to the intense gas-liquid turbulence in the throat of the Venturi valve.

Abstract: The present invention is a gas/liquid separator which is employed to remove free gases from a liquid. The invention is comprised of two concentric cones with a tapering annulus therebetween. The liquid stream to be de-gassed enters a tangential fluid inlet under pressure and passes downwardly in the tapered annulus. The inner surface of the outer cone has a plurality of stator vanes which minimize turbulence of the liquid and maintains helical motion. The outer surface of the inner cone has a plurality of orifices to receive gas bubbles. The outer surface of the inner cone is preferably roughened to thicken the gas boundary layer of this surface such that gas bubbles are more readily trapped thereon. The unit imparts a downward helical motion to the liquid flow between the outer cone and the inner cone.

Abstract: The present invention includes an improved gasket and coupon for use with a corrosion measurement system. The gasket includes a pair of collar portions which fit into an end of the coupon. The central rib of the gasket has a pair of beveled faces each of which fit flush with the exterior edge of a coupon when the coupon and gaskets are pressure fit into the sleeve. The central rib includes a flat outer edge that contacts the inner wall of the sleeve to stabilize the coupon within the sleeve and to prevent liquid from leaking between two adjacent gaskets. The coupon includes a first material, copper, a portion of which is coated with a second material, lead/tin, such that a galvanic cell is formed. Preferably, the lead/tin coating is placed on the interior and exterior of the upper or lower half of the coupon, the other half of the galvanic cell of the coupon remains uncoated copper.