Abstract: Systems and methods of detecting wireless channel status from acoustic discrimination of spectral content are described. In one aspect, a wireless system includes a spectrum analyzer, a detector, and a controller. The spectrum analyzer is operable to acoustically discriminate spectral content of an input electrical signal in multiple discrete frequency channels. The detector is operable to determine respective statuses of the frequency channels from the acoustically discriminated spectral content. The controller is operable to select one of the frequency channels based on the determined statuses of the frequency channels.

Abstract: A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.

Abstract: A spectrum analyzer includes an array of frequency-selective bulk acoustic wave (BAW) resonators each tuned to a predetermined different resonant frequency. The spectrum analyzer further includes a broadband BAW resonator that generates acoustic energy when connected to a signal source. An acoustic coupling transmits the acoustic energy generated by the broadband BAW resonator to the frequency-selective BAW resonators so that one of the frequency-selective BAW resonators will generate an electrical output signal if the acoustic energy transmitted from the broadband BAW resonator contains spectral components at its predetermined resonant frequency.

Abstract: A three-stage liquid metal switch employing electrowetting on dielectric (EWOD), including a common EWOD switch 1310 having an input port 1302, a first shared-EWOD-switch output 1336, and a second shared-EWOD-switch output 1338; a first EWOD switch 1340 having a first-EWOD-switch input 1343, a first output port 1304, and a first-EWOD-switch output 1368; and a second EWOD switch 1370 having a second-EWOD-switch input 1373, a second output port 1306, and a second-EWOD-switch output 1398; wherein the first shared-EWOD-switch output 1336 is operably connected to the first-EWOD-switch input 1343, and the second shared-EWOD-switch output 1338 is operably connected to the second-EWOD-switch input 1373.

Abstract: Capacitive sensors using liquid metals can be fabricated using MEMS device design and fabrication techniques. Movement of the liquid metal in response to a stimulus can provide measurable changes in capacitance of the devices.

Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.

Abstract: One or more optical motion sensors are connected to a central processing device. At least one of the motion sensors captures representations of a region, such as images or patterns that represent the region. Each optical motion sensor processes its representations to generate resulting data that are used to detect whether an object moved in relation to a respective motion sensor. Any relative motion may be detected by each optical motion sensor or by the central processing device using resulting data received from the optical motion sensor or sensors.

Abstract: Oscillator circuits formed using various different topologies can be used to generate signals depending on the capacitance of a capacitive sensor. The sensor capacitance is used to pull the resonance frequency of a resonator included in an oscillator circuit. As the capacitance changes, the oscillator frequency changes in direct relation. The oscillator signal is then transmitted via a suitable transmission link to a receiver, where it is recovered and processed as desired.

Abstract: Systems and methods of detecting wireless channel status from acoustic discrimination of spectral content are described. In one aspect, a wireless system includes a spectrum analyzer, a detector, and a controller. The spectrum analyzer is operable to acoustically discriminate spectral content of an input electrical signal in multiple discrete frequency channels. The detector is operable to determine respective statuses of the frequency channels from the acoustically discriminated spectral content. The controller is operable to select one of the frequency channels based on the determined statuses of the frequency channels.

Abstract: A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.

Abstract: A spectrum analyzer includes an array of frequency-selective bulk acoustic wave (BAW) resonators each tuned to a predetermined different resonant frequency. The spectrum analyzer further includes a broadband BAW resonator that generates acoustic energy when connected to a signal source. An acoustic coupling transmits the acoustic energy generated by the broadband BAW resonator to the frequency-selective BAW resonators so that one of the frequency-selective BAW resonators will generate an electrical output signal if the acoustic energy transmitted from the broadband BAW resonator contains spectral components at its predetermined resonant frequency.

Abstract: An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

Abstract: A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

Abstract: A display includes a convertible mirror layer overlying at least a portion of a display screen. The convertible mirror layer converts between a transparent state and a reflective state.

Abstract: A miniaturized relay with an integrated electromagnetic actuator allows scaling a reed relay to a small size to reduce the power needed to actuate it while retaining a high quality liquid metal contact. A dragged liquid metal contact is used. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities that occur due to impedance changes.

Abstract: Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

Abstract: A miniaturized relay with an integrated electromagnetic actuator allows scaling a reed relay to a small size to reduce the power needed to actuate it while retaining a high quality liquid metal contact. A dragged liquid metal contact is used. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities that occur due to impedance changes.

Abstract: Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

Abstract: An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.