Patents by Inventor Steven Ross Codding

Steven Ross Codding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for recycling of ion implantation monitor wafers
    Patent number: 7732303
    Abstract: A method of recycling monitor wafers. The method includes: (a) providing a semiconductor wafer which includes a dopant layer extending from a top surface of the wafer into the wafer a distance less than a thickness of the wafer, the dopant layer containing dopant species; after (a), (b) attaching an adhesive tape to a bottom surface of the wafer; after (b), (c) removing the dopant layer; and after (c), (d) removing the adhesive tape.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: June 8, 2010
    Assignee: International Business Machines Corporation
    Inventors: Steven Ross Codding, Joseph R. Greco, Timothy Charles Krywanczyk
  • Recycling of ion implantation monitor wafers
    Patent number: 7700488
    Abstract: A wafer processing method. The method includes providing a semiconductor wafer. The semiconductor wafer includes (i) a semiconductor layer and (ii) a dopant layer on top of the semiconductor layer. The dopant layer comprises dopants. The method further includes removing the dopant layer from the semiconductor wafer. No chemical etching is performed on the dopant layer before said removing the dopant layer is performed.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: April 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Steven Ross Codding, Joseph R. Greco, Timothy Charles Krywanczyk
  • METHOD FOR RECYCLING OF ION IMPLANTATION MONITOR WAFERS
    Publication number: 20090197400
    Abstract: A method of recycling monitor wafers. The method includes: (a) providing a semiconductor wafer which includes a dopant layer extending from a top surface of the wafer into the wafer a distance less than a thickness of the wafer, the dopant layer containing dopant species; after (a), (b) attaching an adhesive tape to a bottom surface of the wafer; after (b), (c) removing the dopant layer; and after (c), (d) removing the adhesive tape.
    Type: Application
    Filed: January 31, 2008
    Publication date: August 6, 2009
    Inventors: Steven Ross Codding, Joseph R. Greco, Timothy Charles Krywanczyk
  • RECYCLING OF ION IMPLANTATION MONITOR WAFERS
    Publication number: 20080171439
    Abstract: A wafer processing method. The method includes providing a semiconductor wafer. The semiconductor wafer includes (i) a semiconductor layer and (ii) a dopant layer on top of the semiconductor layer. The dopant layer comprises dopants. The method further includes removing the dopant layer from the semiconductor wafer. No chemical etching is performed on the dopant layer before said removing the dopant layer is performed.
    Type: Application
    Filed: January 16, 2007
    Publication date: July 17, 2008
    Inventors: Steven Ross Codding, Joseph R. Greco, Timothy Charles Krywanczyk