Abstract: Systems, methods and apparatus are provided through which in some implementations a frame, such as shaped as a square or rectangle, and multiple elastic bands or tubes connected at either end to the frame, and apparatus to secure the frame vertically, such as against a wall.

Abstract: An optical navigation apparatus including a package incorporating a light source and a single die of silicon. The single die of silicon includes a photodiode array configured at the detection plane to receive the speckle pattern of the scattered light from the collection optics, circuitry configured to process signals from the photodiode array to determine changes in position of the apparatus relative to the tracking surface, analog circuitry configured to control and drive current through the light source, interface circuitry configured to communicate position data by outputting the position data via a data interface, a microcontroller comprising a processor core and memory for storing computer-readable code and data, and a system bus configured to communicate instructions and data between the microcontroller and said digital, analog, and interface circuitries. Other embodiments, aspects and features are also disclosed.

Abstract: A circuit and method are provided to control the strength of signals from an array of photo-detectors (PDs) in an optical navigation sensor. The circuit includes a number of transimpedance-amplifiers (TIAs) each coupled to an output of at least one PD to receive a current signal therefrom and generate a signal in response thereto. A controller coupled to outputs of the TIAs receives the signals and executes an algorithm to adjust gain of a signal processor coupled to the array. In one embodiment, the signal processor includes differential transimpedance-amplifiers (DIFF-TIAs) each including inputs coupled to receive current signals from the array, and the controller outputs a control signal to adjust a time over which the DIFF-TIAs and the TIAs integrate the current signals. Optionally, the signal processor includes gain-amplifiers coupled to the DIFF-TIAs and TIAs, and the controller outputs a signal to adjust gain thereof.

Abstract: A circuit and method are provided to control the strength of signals from an array of photo-detectors in an optical navigation sensor. In one embodiment, the method includes receiving a current signal from an automatic gain control (AGC) photo-detector and generating an AGC signal in response thereto; generating an illumination control signal in response to the AGC signal; and coupling the illumination control signal to an illuminator configured to illuminate at least a portion of an array of photo-detectors with light reflected from a surface to sense displacement of the optical navigation sensor relative to a surface, and adjusting illumination from the illuminator. Other embodiments are also disclosed.

Abstract: One embodiment relates to a user input device for tracking motion. The device includes a tracking ball and a user-accessible touching area for user manipulation of the tracking ball. First and second two-dimensional sensors are positioned at tracking heights away from the tracking ball. The first two-dimensional sensor may be positioned across the tracking ball and opposite to the user-accessible touching area. The second two-dimensional sensor may be positioned at an angle with respect to a z-axis defined as extending from the user-accessible touching area through a center of the tracking ball to the first two-dimensional sensor. Other embodiments, aspects and features are also disclosed.

Abstract: An optical navigation sensor (ONS) is provided having a spatial frequency filter to transmit radiation at selected spatial frequencies while attenuating other, undesired frequencies and harmonics. The ONS includes a radiation source to transmit radiation toward a portion of a surface that diffusely reflects radiation incident thereon. The spatial frequency filter is disposed to receive radiation scattered from the surface, and, in one embodiment, includes a number of non-circular openings to pass radiation of at least one pre-selected frequency while attenuating other frequencies and harmonics of the pre-selected frequency.

Abstract: An optical navigation apparatus including a package incorporating a light source and a single die of silicon. The single die of silicon includes a photodiode array configured at the detection plane to receive the speckle pattern of the scattered light from the collection optics, circuitry configured to process signals from the photodiode array to determine changes in position of the apparatus relative to the tracking surface, analog circuitry configured to control and drive current through the light source, interface circuitry configured to communicate position data by outputting the position data via a data interface, a microcontroller comprising a processor core and memory for storing computer-readable code and data, and a system bus configured to communicate instructions and data between the microcontroller and said digital, analog, and interface circuitries. Other embodiments, aspects and features are also disclosed.

Abstract: The apparatus includes a diode laser and a current source interconnected with the diode laser. Two independent circuits in the current source are configured to limit current flowing through the diode laser. A first current limiter circuit configured to limit a current output from the current source to an anode of the diode laser, and an independent second current limiter circuit configured to limit a current return from a cathode of the diode laser to the current source so that laser output power does not exceed a specified maximum regardless of a single fault in either the first or second current limiter circuits.

Abstract: The apparatus includes a diode laser, a current source interconnected with the diode laser, and four limiting circuits. The first limiting circuit limits peak current flowing to an anode connection of the diode laser. The second limiting circuit limits peak current flowing from a cathode connection of the diode laser, wherein the first and second limiting circuits are independent from each other. The third limiting circuit limits average current flowing through the diode laser. Finally, the fourth limiting circuit limits average current flowing through the diode laser, wherein the third and fourth limiting circuits are independent from each other. Other embodiments and features are also disclosed.

Abstract: One embodiment relates to a laser positioning device for sensing relative movement between a data input device and a surface by determining displacement of image features in a succession of images of the surface. The device forms a single integrated package, which includes a planar substrate and a transparent encapsulant that also embodies a collimating lens. Both a coherent light source and a sensor array and associated circuitry are configured on the planar substrate. Another embodiment relates to a method of sensing relative movement between a data input device and a surface. Coherent light is emitted from a laser and collimated so as to form a collimated illumination beam with a predetermined diameter, D, and a substantially uniform phase front. A speckle pattern is generated by impingement of the collimated illumination beam on the surface and detected by a sensor array. Other embodiments are also disclosed.

Abstract: A system and method are provided for screening a semiconductor laser. The method includes: (i) operating the laser at a first of a number of drive currents; (ii) acquiring a number (N) of frames of data from a sensor in an optical navigation system (ONS) receiving speckle pattern in light from the laser reflected from a surface proximal to the ONS, the sensor data including differential signal values; (iii) calculating an average differential signal value (AVG) for the N frames of data; (iv) sorting the N frames of data across a plurality of bins including a Bin_0 for frames of data having a differential signal value within a predetermined amount of the AVG; and (v) determining if a number of frames of data in any bins other than Bin_0 exceed a predetermined threshold, and if so recording the drive current.

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract: A test system and method are provided for testing in parallel radiant output of multiple light emitting devices. Generally, the method involves: (i) providing a system having a master, calibrated power meter (CPM), a source transfer standard (STS), and multiple secondary, test site power meters (TSPMs); (ii) determining a relationship between electrical power supplied to the STS and a radiant output therefrom as measured by the CPM; (iii) calibrating the TSPMs using the STS and the relationship between the power supplied to the STS and the radiant output therefrom as determined by the CPM; and (iv) positioning the devices undergoing test on a fixture of the test system and positioning the fixture relative to the TSPMs to test radiant outputs of the devices.

Abstract: One embodiment relates to an optical navigation device. The device includes a lead frame having reference features, a laser, a detector array, and an optical component having alignment features. The laser is attached to the lead frame and positioned in reference to the reference features of the lead frame. The detector array is attached to the lead frame and positioned in reference to the reference features of the lead frame. The optical component is coupled to the lead frame so that its alignment features register to the reference features of the lead frame. In this way, the molded optical component is passively aligned to the laser and the detector array. Other embodiments are also disclosed.

Abstract: Described herein are solar energy apparatus that overcome many of the disadvantages and shortcomings of conventional solar energy absorption structures. The solar energy apparatus may comprise inexpensive material and have smaller dimensions to reduce the overall cost of the apparatus. The apparatus may also have coatings which help to maximize the amount of solar energy absorbed and minimize the deterioration of the apparatus due to overheating. The apparatus may include a system for monitoring and controlling the temperature of the apparatus to prevent overheating.

Abstract: A method and a system for adjusting the sensitivity of an optical sensor are provided. A first beam of light in an optical fiber is separated into first and second portions propagating therethrough at a first speed. A second beam of light is directed into the optical fiber to interact with the first beam of light such that the first and second portions propagate through the optical fiber at a second speed. The propagation speed in turn influences the sensitivity of the optical sensor.

Abstract: One embodiment relates to an optical navigation apparatus which provides fault-tolerant limitation of laser output power. The apparatus includes a diode laser and a current source interconnected with the diode laser. Two independent circuits in the current source are configured to limit current flowing through the diode laser. Another embodiment relates to a method of providing fault-tolerant limitation of laser output power in an optical navigation apparatus. A first digital current limit value is converted to a first analog signal, and the first analog signal is used to limit an electrical current from a power supply connection to an anode of a diode laser. A second digital current limit value is converted to a second analog signal, and the second analog signal is used to limit an electrical current from a cathode of the diode laser to a ground connection. Other embodiments are also disclosed.

Abstract: The present invention provides percutaneously absorbable adhesive preparations and transdermal compositions comprising Sufentanil, which are obtained from economic starting materials, have a constitution simpler than that of conventional Sufentanil adhesive preparations, and have effective skin permeability. The preparations and compositions comprise two polyisobutylenes having different molecular weights, a tackifier, a permeation enhancer.

Abstract: A device for transferring data arrays between at least two buses, the device comprising storage means for storing at least one data array, a first input/output interface for transferring data arrays in a first direction from a first of the buses (RBUS) to the storage means and in a second direction from the storage means to the first bus (RBUS), a second input/output interface for transferring data arrays in a third direction from a second of the buses (MBUS) to the storage means and in a fourth direction from the storage means to the second bus (MBUS), the first and second interfaces being concurrently operable in each clock cycle, the device comprising means for receiving an instruction word within a clock cycle, the first interface being provided with first selecting means for selecting one of said first and second directions and the second interface being provided with second selecting means for selecting one of said third and fourth directions, the first and second selecting means being connected to said

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.