Abstract: A wireless sensor device includes a processor connected to a wireless transmitter and at least one sensor, and a power source connected to power the processor and the wireless transmitter. The processor has two or more states. An internal control element senses at least one predetermined condition. The internal control element switches the processor between states based on the occurrence of at least one predetermined condition. A molded body encloses at least the processor, the wireless transmitter, and the internal control sensor. The internal control sensor is physically isolated within the molded body.

Abstract: A containment integrity sensor device has a force sensor integrally formed within an elastic compressible material, the elastic compressible material having a first surface and a second surface opposite the first surface. The force sensor generates a signal in response to a compressive force applied to the first and second surfaces, the signal being indicative of the compressive force.

Abstract: A method and apparatus are provided for transmission/reception of signals between automatic test equipment (ATE) and a device under test (DUT). A probe card has a plurality of associated proximate active probe integrated circuits (APIC) connected to a plurality of probes. Each APIC interfaces with one or more test interface points on the DUT through probes. Each APIC receives and processes signals communicated between the ATE and the DUT. Low information content signals transmitted from the ATE are processed into high information content signals for transmission to the probe immediately adjacent the APIC, and high information content or time critical signals received by the APIC from the DUT are transmitted as low information content signals to the ATE. Because the APIC is immediately adjacent the probe there is minimum loss or distortion of the information in the signal from the DUT.

Abstract: A method and apparatus are provided for transmission/reception of signals between automatic test equipment (ATE) and a device under test (DUT). A probe card has a plurality of associated proximate active probe integrated circuits (APIC) connected to a plurality of probes. Each APIC interfaces with one or more test interface points on the DUT through probes. Each APIC receives and processes signals communicated between the ATE and the DUT. Low information content signals transmitted from the ATE are processed into high information content signals for transmission to the probe immediately adjacent the APIC, and high information content or time critical signals received by the APIC from the DUT are transmitted as low information content signals to the ATE. Because the APIC is immediately adjacent the probe there is minimum loss or distortion of the information in the signal from the DUT.

Abstract: An apparatus for interrogating an electronic circuit supported by a substrate includes a tester external to the substrate and comprising an tester transceiver. A testing circuit is supported by the substrate and connected to the electronic circuit. The testing circuit includes a processor and a testing circuit transceiver in communication with the tester transceiver for transmitting instructions from the tester to the processor and for transmitting results of an interrogation from the processor to the tester. The processor being programmed to process instructions from the tester to interrogate the electronic circuit with an interrogation corresponding to the instructions.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: A wireless sensor device includes a processor connected to a wireless transmitter and at least one sensor, and a power source connected to power the processor and the wireless transmitter. The processor has two or more states. An internal control element senses at least one predetermined condition. The internal control element switches the processor between states based on the occurrence of at least one predetermined condition. A molded body encloses at least the processor, the wireless transmitter, and the internal control sensor. The internal control sensor is physically isolated within the molded body.

Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Abstract: A method and apparatus for interrogating an electronic component (20), includes a body (18 or 102) having an interface (10, 24, 108 or 154) for an interrogating device (48/50 or 106) to use as a conduit in reliably performing multiple discrete interrogations of the electronic component (20) without the interrogating device physically touching the electronic component (20).

Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Abstract: A thin film transistor (TFT) array having test circuitry includes a thin film transistor array body having a plurality of pixels. Test circuitry is integrally formed with the body. The test circuitry includes a power supply for supplying power via the test circuitry to the body; and a plurality of wireless switches to activate selected pixels.

Abstract: There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: An apparatus for interrogating an electronic circuit supported by a substrate includes a tester external to the substrate and comprising an tester transceiver. A testing circuit is supported by the substrate and connected to the electronic circuit. The testing circuit includes a processor and a testing circuit transceiver in communication with the tester transceiver for transmitting instructions from the tester to the processor and for transmitting results of an interrogation from the processor to the tester. The processor being programmed to process instructions from the tester to interrogate the electronic circuit with an interrogation corresponding to the instructions.

Abstract: A method and apparatus are provided for transmission/reception of signals between automatic test equipment (ATE) and a device under test (DUT). A probe card has a plurality of associated proximate active probe integrated circuits (APIC) connected to a plurality of probes. Each APIC interfaces with one or more test interface points on the DUT through probes. Each APIC receives and processes signals communicated between the ATE and the DUT. Low information content signals transmitted from the ATE are processed into high information content signals for transmission to the probe immediately adjacent the APIC, and high information content or time critical signals received by the APIC from the DUT are transmitted as low information content signals to the ATE. Because the APIC is immediately adjacent the probe there is minimum loss or distortion of the information in the signal from the DUT.

Abstract: A thin film transistor (TFT) array having test circuitry includes a thin film transistor array body having a plurality of pixels. Test circuitry is integrally formed with the body. The test circuitry includes a power supply for supplying power via the test circuitry to the body; and a plurality of wireless switches to activate selected pixels.

Abstract: A method and apparatus for interrogating an electronic component (20), includes a body (18 or 102) having an interface (10, 24, 108 or 154) for an interrogating device (48/50 or 106) to use as a conduit in reliably performing multiple discrete interrogations of the electronic component (20) without the interrogating device physically touching the electronic component (20).

Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Abstract: An embeddable single board computer includes a microprocessor, memory and a PCI interface all operatively connected on a DIMM standard form factor.