Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A sample collecting device is provided. The sample collecting device includes a frame, a collect part and a control part. The collect part is disposed in the frame and is provided with a collecting cavity having a collecting port, and the collect part is used to make a sample flow into the collecting cavity from the collecting port. The control part is disposed in the frame, used to make a collecting rod put into a reagent bottle be pulled out and inserted into the collecting cavity to thereby collect the sample, and used to make the collecting rod with the sample be pulled out from the collecting cavity and put back into the reagent bottle. The collecting of sample without manual intervention is realized, effectiveness and consistency of the collected samples are ensured, and the labor cost is reduced.

Abstract: A sample collecting device is provided. The sample collecting device includes a frame, a collect part and a control part. The collect part is disposed in the frame and is provided with a collecting cavity having a collecting port, and the collect part is used to make a sample flow into the collecting cavity from the collecting port. The control part is disposed in the frame, used to make a collecting rod put into a reagent bottle be pulled out and inserted into the collecting cavity to thereby collect the sample, and used to make the collecting rod with the sample be pulled out from the collecting cavity and put back into the reagent bottle. The collecting of sample without manual intervention is realized, effectiveness and consistency of the collected samples are ensured, and the labor cost is reduced.

Abstract: Systems and methods are disclosed for partitioning an animatable model. The system may include a non-transitory computer-readable medium operatively coupled to processors. The non-transitory computer-readable medium may store instructions that, when executed, cause the processors to perform a number of operations. One operation may include obtaining an animatable model. The animatable model may include a geometry matrix. Another operation may include obtaining user input to partition an animatable model into multiple partitions. The user input may include a connected curve in the geometry matrix. Yet another operation may include partitioning the animatable model into the multiple partitions based on the user input. Individual ones of the multiple partitions may include a partition geometry matrix and a corresponding partition animatable model.

Abstract: Systems and methods are disclosed for partitioning an animatable model. The system may include a non-transitory computer-readable medium operatively coupled to processors. The non-transitory computer-readable medium may store instructions that, when executed, cause the processors to perform a number of operations. One operation may include obtaining an animatable model. The animatable model may include a geometry matrix. Another operation may include obtaining user input to partition an animatable model into multiple partitions. The user input may include a connected curve in the geometry matrix. Yet another operation may include partitioning the animatable model into the multiple partitions based on the user input.

Abstract: A reclosable food tray is disclosed comprising a receptacle portion and two pairs of opposing closure flaps. The receptacle portion has substantially trapezoidal volume defined by a rectangular shaped bottom panel and two substantially upstanding pair of opposing side panels. The opposing side panels defined four pairs of adjacent panels which are hingedly connected in liquid-sealed manner by four folded gussets secured by three pairs of notch cuts. The notch cut is a curved and hook-like cut serves as interlocking mechanism to hold the food tray together. The pair of notch cuts can also be disconnected from each other to open the panel(s). The notch cut enable the food tray shipping in blank and erected by end user, also eliminates metal wire and adhesives that are commonly used by prior arts. A carrying strap purposely designed for carrying one or multiple food tray is a component of the invention.

Abstract: A reclosable food tray is disclosed comprising a receptacle portion and two pairs of opposing closure flaps. The receptacle portion has substantially trapezoidal volume defined by a rectangular shaped bottom panel and two substantially upstanding pair of opposing side panels. The opposing side panels defined four pairs of adjacent panels which are hingedly connected in liquid-sealed manner by four folded gussets secured by three pairs of notch cuts. The notch cut is a curved and hook-like cut serves as interlocking mechanism to hold the food tray together. The pair of notch cuts can also be disconnected from each other to open the penal(s). The notch cut enable the food tray shipped in blank and erected by end user, also eliminates metal wire and adhesives that are commonly used by prior arts. A carrying strap purposely designed for carrying one or multiple food trays is a component of the invention.

Abstract: The present invention is a novel electronic technique that detects stress/strain in any conductive or semiconductive material. The technique is based on passing a current through the material of interest and analyzing the low frequency voltage fluctuation. The voltage fluctuation is very sensitive to the amount of stress present in the sample. The voltage fluctuation is a result of interactions between the imposed current and material itself. The technique is many orders of magnitude more sensitive than any present method. The technique is suitable for sensitive measurements without a strain gauge. The technique is not limited by sample size, and provides a simple, fast, nondestructive and on-site evaluation of stress/strain in a material.