Patents by Inventor Steven Strickman

Steven Strickman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Palladium enhanced soldering and bonding of semiconductor device contacts
    Patent number: 5225711
    Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: July 6, 1993
    Assignee: International Business Machines Corporation
    Inventors: Chin-An Chang, Nicholas G. Koopman, Judith M. Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh
  • Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
    Patent number: 5048744
    Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: September 17, 1991
    Assignee: International Business Machines Corporation
    Inventors: Chin-An Chang, Nicholas G. Koopman, Judith M. Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh