Patents by Inventor Steven Swendrowski

Steven Swendrowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manipulation and handling of integrated circuit dice
    Patent number: 4915565
    Abstract: An apparatus for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.
    Type: Grant
    Filed: March 16, 1989
    Date of Patent: April 10, 1990
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison
  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4759675
    Abstract: An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: July 26, 1988
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace
  • Integrated-circuit leadframe adapted for a simultaneous bonding operation
    Patent number: 4722060
    Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: January 26, 1988
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla, Jerry S. Cupples, Barbara R. Mozdzen, Linda S. Wilson, Linn Garrison
  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4627787
    Abstract: A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: December 9, 1986
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace
  • Manipulation and handling of integrated circuit dice
    Patent number: 4626167
    Abstract: A method for inverting and handling integrated circuit dice employs rotating apparatus for rotating a chip carrier by 180 degrees to invert and transfer dice from one set of receptacles to another; together with an apparatus for precisely aligning dice resting at random positions within a set of oversized receptacles.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: December 2, 1986
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison