Patents by Inventor Steven T. Boyd

Steven T. Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for scanning MEMS cantilevers
    Patent number: 11912566
    Abstract: A semiconductor substrate includes a first semiconductor layer, a first dielectric layer coupled to the first semiconductor layer, and a second semiconductor layer coupled to the first dielectric layer. The second semiconductor layer includes a base portion substantially aligned with the first dielectric layer and a cantilever portion protruding from an end of the first dielectric layer. The cantilever portion includes a tapered surface tapering from a bottom surface of the second semiconductor layer toward a top surface of the second semiconductor layer.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: February 27, 2024
    Assignee: Magic Leap, Inc.
    Inventors: Steven Alexander-Boyd Hickman, Sarah Colline McQuaide, Abhijith Rajiv, Brian T. Schowengerdt, Charles David Melville
  • Regenerative hygroscopic filter and method
    Patent number: 5575832
    Abstract: A regenerative hygroscopic filter having a housing containing an inlet port and an outlet port, and, a hydrophilic filter element positioned within the housing and disposed between the inlet and outlet ports, and operatively arranged to filter solid particulate matter and water when gas passes into the inlet port and through the filter element, and to release water via the inlet port when gas passes from the outlet port through the filter element.
    Type: Grant
    Filed: September 21, 1994
    Date of Patent: November 19, 1996
    Assignee: Humidtech Research, Inc.
    Inventor: Steven T. Boyd