Abstract: A method for making a tape for tape automated bonding and the tape made therefrom is presented. In accordance with the present invention, a bonding material is used to both (1) hold the annular support ring in place within the feature window with sufficient tenacity to stabilize the TAB leads; and (2) allow removal of the annular support ring from the TAB leads once the leads have been inner and outer lead bonded (e.g. just before the TAB and microcircuit are encapsulated into a final product). One such bonding material comprises a substance which ordinarily acts as an adhesive, but which has its adhesive bond weakened or destroyed by application of heat, cold, ultraviolet light, infrared light or the like. Still another bonding material is a pressure-sensitive strong enough to hold the support ring in place during all operations up to and including inner and outer lead bonding; but weak enough to allow it to be peeled away thereafter, without harming the leads or the inner/outer lead bonds.