Abstract: A method and system for supplying control signals to two or more force actuators wherein each of the two or more force actuators having a defined force value. The method includes sending a first set of control signals to each of the actuators to ramp forces supplied to reach the defined force value at a same initial defined value time and sending a second set of control signals to each of the actuators to reduce the forces supplied starting at a same final defined value time to individual set point values, and wherein each of the two of more force actuators reach their individual set point values at a same set point time.

Abstract: A method and system for supplying control signals to two or more force actuators wherein each of the two or more force actuators having a defined force value. The method includes sending a first set of control signals to each of the actuators to ramp forces supplied to reach the defined force value at a same initial defined value time and sending a second set of control signals to each of the actuators to reduce the forces supplied starting at a same final defined value time to individual set point values, and wherein each of the two of more force actuators reach their individual set point values at a same set point time.

Abstract: A method and system for imprinting a substrate supported on a moveable stage is provided and includes contacting a liquid resist on the substrate with a template and aligning the substrate with the template using a feedback-feedforward control process with a first set of control parameters. Calibration data is obtained and the viscosity of at least a portion of the resist is increased. The substrate is then with the template using the feedback-feedforward control process with a second set of control parameters after the viscosity of the resist has increased, the second set of control parameters are determined based on the calibration data and the resist is cured under the template.

Abstract: A method and system for imprinting a substrate supported on a moveable stage is provided and includes contacting a liquid resist on the substrate with a template and aligning the substrate with the template using a feedback-feedforward control process with a first set of control parameters. Calibration data is obtained and the viscosity of at least a portion of the resist is increased. The substrate is then with the template using the feedback-feedforward control process with a second set of control parameters after the viscosity of the resist has increased, the second set of control parameters are determined based on the calibration data and the resist is cured under the template.

Abstract: A method and system for supplying control signals to two or more force actuators wherein each of the two or more force actuators having a defined force value. The method includes sending a first set of control signals to each of the actuators to ramp forces supplied to reach the defined force value at a same initial defined value time and sending a second set of control signals to each of the actuators to reduce the forces supplied starting at a same final defined value time to individual set point values, and wherein each of the two of more force actuators reach their individual set point values at a same set point time.

Abstract: A method and system for imprinting a substrate supported on a moveable stage is provided and includes contacting a liquid resist on the substrate with a template and aligning the substrate with the template using a feedback-feedforward control process with a first set of control parameters. Calibration data is obtained and the viscosity of at least a portion of the resist is increased. The substrate is then with the template using the feedback-feedforward control process with a second set of control parameters after the viscosity of the resist has increased, the second set of control parameters are determined based on the calibration data and the resist is cured under the template.

Abstract: A method and system for controlling a position of a moveable stage having a substrate supported thereon is provided. First position information representing a position of the substrate relative to a mark on an object is obtained from a sensor. Alignment prediction information is generated based on the obtained first position wherein the generated alignment prediction information including at least one parameter value. First trajectory information is generated and includes the at least one parameter value based on the obtained first position information and the generated alignment prediction information. Second trajectory information is generated based on the generated alignment prediction information first trajectory information and second position information, wherein the second position information represents a position of the moveable stage.

Abstract: A method and system for controlling a position of a moveable stage having a substrate supported thereon is provided. First position information representing a position of the substrate relative to a mark on an object is obtained from a sensor. Alignment prediction information is generated based on the obtained first position wherein the generated alignment prediction information including at least one parameter value. First trajectory information is generated and includes the at least one parameter value based on the obtained first position information and the generated alignment prediction information. Second trajectory information is generated based on the generated alignment prediction information first trajectory information and second position information, wherein the second position information represents a position of the moveable stage.

Abstract: A method for extracting blanket (qual) polish rates from interferometry signals off patterned (product) wafer polish during non-enpointed CMP. The method includes estimating polish rates using polish data near the end of the polish period. Non-linear regression and iterative optimization is presented to extract relevant information. The processing includes least square processing step (43), determining the search fit (44) and determining if this is the best fit (45).

Abstract: A tuned run-to-run controlled system is disclosed that provides tuned run-to-run control of a system. The system includes a controlled system coupled to a tuned run-to-run controller, which contains a feedback controller coupled to a tuner. Tuned run-to-run controller determines a feedback command based on a nominal gain, a maximum gain, a process error, and a tuning gain.

Abstract: A method for extracting wafer-to-wafer thickness variation from interferometry signals off patterned (product) wafer polish during non-endpointed CMP. The method includes sensing sample signals representing polishing trace from product wafers near the end of polishing period from at least two product wafers (101); estimating the value of the phase of the first and second wafers using polish data near the end of the polish period using nonlinear regression algorithm processing (103) and the GOF test (104); and calculating the difference in final thickness using the phase (105).

Abstract: A method for dispatching available lots to unallocated machines is provided that includes receiving metrics data (26) providing performance measurements for a plurality of machines (18). The method next provides for determining a state for each of the machines (18) based on the metrics data (26). The method next provides for receiving one or more lots (22) to be dispatched where each lot (22) has a lot type and each lot type is associated with one of a plurality of models. The method next provides for selecting a preferred lot type (50) for each of the plurality of models associated with each of the machines (18) based on the state of the machine. The method next provides for selecting a preferred model (52) based on a time since a last run of the model, a cost of switching to a new model and lot type, and the state of the machine (18).

Abstract: A method for extracting wafer-to-wafer thickness variation from interferometry signals off patterned (product) wafer polish during non-endpointed CMP. The method includes sensing sample signals representing polishing trace from product wafers near the end of polishing period from at least two product wafers (101); estimating the value of the phase of the first and second wafers using polish data near the end of the polish period using nonlinear regression algorithm processing (103) and the GOF test (104); and calculating the difference in final thickness using the phase (105).

Abstract: A method for extracting blanket (qual) polish rates from interferometry signals off patterned (product) wafer polish during non-enpointed CMP. The method includes estimating polish rates using polish data near the end of the polish period. Non-linear regression and iterative optimization is presented to extract relevant information. The processing includes least square processing step (43), determining the search fit (44) and determining if this is the best fit (45).

Abstract: A method for dispatching available lots to unallocated machines is provided that includes receiving metrics data (26) providing performance measurements for a plurality of machines (18). The method next provides for determining a state for each of the machines (18) based on the metrics data (26). The method next provides for receiving one or more lots (22) to be dispatched where each lot (22) has a lot type and each lot type is associated with one of a plurality of models. The method next provides for selecting a preferred lot type (50) for each of the plurality of models associated with each of the machines (18) based on the state of the machine. The method next provides for selecting a preferred model (52) based on a time since a last run of the model, a cost of switching to a new model and lot type, and the state of the machine (18).