Patents by Inventor Steven T. Mear
Steven T. Mear has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090044838Abstract: In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.Type: ApplicationFiled: October 12, 2008Publication date: February 19, 2009Inventors: Bruce Willing, Daniel P. Forster, David Datong Huo, Robert D. Tolles, Christopher L. Haynes, Steven T. Mear, David Paul, William M. Evans
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Patent number: 7207871Abstract: A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.Type: GrantFiled: October 6, 2005Date of Patent: April 24, 2007Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Hung Chih Chen, Thomas Brezoczky, Steven T. Mear
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Publication number: 20040053566Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: July 15, 2003Publication date: March 18, 2004Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6592438Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: January 12, 2001Date of Patent: July 15, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6575825Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: January 12, 2001Date of Patent: June 10, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Patent number: 6439964Abstract: Recipes for the polishing machine, such as recipes for carrier head pressure, are generated from empirical data, and consequently can provide a more accurate prediction than techniques based upon theoretical models. A plurality of test substrates are polished with a plurality of parameter sets. A polishing profile is measured for each of the plurality of test substrates, and a polishing time is calculated for each polishing parameter set which minimizes the difference between a predicted substrate profile and a desired substrate profile.Type: GrantFiled: June 30, 2000Date of Patent: August 27, 2002Assignee: Applied Materials, Inc.Inventors: Gopalakrishna B. Prahbu, Steven T. Mear
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Patent number: 6361419Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A volume between the flexible membrane and a carrier structure provides a chamber. A body located in the chamber has a first portion that applies pressure to a first region of an upper surface of a central portion of the flexible membrane and a second portion that is separable and movable into contact with a second region of the upper surface of the central portion of the flexible membrane.Type: GrantFiled: March 27, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Gopalakrishna B. Prahbu, Steven T. Mear
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Publication number: 20010008830Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: ApplicationFiled: January 12, 2001Publication date: July 19, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Publication number: 20010005667Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: January 12, 2001Publication date: June 28, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6220942Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: April 2, 1999Date of Patent: April 24, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6217426Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: April 6, 1999Date of Patent: April 17, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen