Abstract: The present disclosure relates to a semiconductor package. The semiconductor package includes a semiconductor die, molding material, and a conductive structure. The conductive structure is at least partly stacked with the semiconductor die, and the conductive structure includes a plurality of slots positioned around a point of the semiconductor die. The plurality of slots is configured to equalize thermal stresses during the operation of the semiconductor die about the point of the semiconductor die, where the thermal stresses are associated with coefficient of thermal expansion mismatches between the conductive structure and the molding material. In addition, at least a portion of the molding material is in contact with the conductive structure.

Abstract: A two-phase cooling apparatus for an information handling system, including a container holding dielectric fluid, the dielectric fluid having a vapor-fluid boundary within the container, the container further containing a printed circuit board (PCB) including computing components, with the dielectric fluid surrounding the PCB and the computing components, the dielectric fluid decreasing a temperature of the PCB by removing heat from the PCB in the form of vaporization; a pump positioned within the container, the pump capturing a portion of vapor of the dielectric fluid, at the vapor-fluid boundary, that results from the vaporization of the dielectric fluid; and a diffuser positioned within the container and coupled to the pump to introduce the captured vapor into the dielectric fluid.

Abstract: Methods and systems for high frequency injection and detection for improved false acceptance reduction are disclosed. An information handling system may be configured to receive audio data and to add an identification signal to the audio data, wherein the identification signal is determined based on the audio data. The combined audio data and the identification signal may be output to a receiving device. An information handling system may also be configured to receive data that includes audio data and an identification signal that is associated with one or more frequencies in the audio data, identify the one or more frequencies in the audio data that are associated with the identification signal, and attenuate the one or more frequencies in the audio data to obtain modified audio data. The modified audio data may be output for audio processing.

Abstract: Methods and systems for high frequency injection and detection for improved false acceptance reduction are disclosed. An information handling system may be configured to receive audio data and to add an identification signal to the audio data, wherein the identification signal is determined based on the audio data. The combined audio data and the identification signal may be output to a receiving device. An information handling system may also be configured to receive data that includes audio data and an identification signal that is associated with one or more frequencies in the audio data, identify the one or more frequencies in the audio data that are associated with the identification signal, and attenuate the one or more frequencies in the audio data to obtain modified audio data. The modified audio data may be output for audio processing.