Abstract: A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween.

Abstract: An amplifier circuit for a cable access television line amplifier has a circuit input and a circuit output and includes a first cascode amplifier having a first input and a first output, and a second cascode amplifier having a second input and a second output where the second cascode amplifier is coupled in a push-pull arrangement with the first cascode amplifier. The amplifier circuit further includes input circuitry for coupling the circuit input to the first and second inputs and output circuitry for coupling the first and second outputs to the circuit output. The first cascode amplifier includes a first field effect transistor coupled to the first input; the second cascode amplifier includes a second field effect transistor coupled to the second input; the first cascode amplifier further includes a third field effect transistor coupled to the first output; and the second cascode amplifier further includes a fourth field effect transistor coupled to the second output.

Abstract: A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes a metal slug formed integrally with the circuit package, the heat dissipating circuit being bonded to an obverse surface of the metal slug. The printed wiring board includes first and second metal lands, the first metal land being disposed on an obverse surface of the printed wiring board, the second metal land being disposed on a reverse surface of the printed wiring board. A solder film is formed bonded to and thermally coupling a reverse surface of the metal slug to the first metal land, and a plurality of solder posts are formed, each post bonding to and thermally coupling the first metal land to the second metal land. The metal case is pressed against the second metal land with a grease film of thermally conductive grease squeezed therebetween.