Abstract: The present invention includes compositions relating to a hot melt adhesive that includes a copolymer of butene-1, a wax, and a tackifying resin. The present invention further relates to adhesives initially exhibiting adhesion properties and subsequently non-adhesion qualities. Methods of using these adhesives are also part of the claimed invention.

Abstract: The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.

Abstract: An ethylene-butene copolymer prepared from ethylene monomer and butene monomer, the ethylene-butene copolymer including at least 78 mole % ethylene and no greater than 22 mole % butene, and a hot melt adhesive composition including from 40% by weight to 90% by weight of the ethylene-butene copolymer, tackifying agent, and wax.

Abstract: A wireless transmitter (201) transmits (102) a message intended for at least one wireless personal communications device (202). That message comprises content (203) configured and arranged to at least attempt to prompt a particular operability configuration for the wireless personal communications device that conforms to social standards as correspond to a given local venue (204). Such content can vary with the application setting with some relevant examples comprising, but not being limited to, information indicative of a degree to which the operability configuration comprises a required operability configuration (as versus a voluntary or merely suggested configuration), information indicative of at least one particular capability of the wireless personal communication device to which the operability configuration pertains, and/or information corresponding to a time frame during which the operability configuration is applicable, to note but a few.

Abstract: The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin.

Abstract: This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65° C. and a thermoplastic polymer.

Abstract: This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65° C. and a thermoplastic polymer.

Abstract: Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.

Abstract: Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.

Abstract: A hot melt useful for packaging, comprising from about 10% to about 30% by weight of at least one copolymer of ethylene and methyl acrylate (both acrylates and methacrylates); from about 10% to about 20% by weight of at least one copolymer of ethylene and n-butyl acrylate (both acrylates and methacrylates), wherein the total polymer content does not exceed 40% by weight, and the total ethylene n-butyl acrylate copolymer content does not exceed the total ethylene methyl acrylate copolymer content by percent weight in the adhesive; from about 20% to about 60% by weight of at least one tackifying resin selected from the group consisting of rosins and modified rosins and hydrogenated derivatives; aliphatic, cycloaliphatic and aromatic hydrocarbon resins and modified hydrocarbon resins and hydrogenated derivatives; terpenes and modified terpenes and hydrogenated derivatives; and mixtures thereof; from about 5% to about 30% by weight of at least one wax; and up to about 2% by weight of an antioxidant; wherein the r