Abstract: A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.

Abstract: A roofing material having the appearance of decorative shingles and/or roofing tiles. The roofing material comprises a bulk polymeric foam material which includes additional structural support which provides increased strength and durability at the front surface of the roofing material. The roofing material includes a mesh material which is disposed near the front surface of the roofing material. The roofing material may additionally include a barrier layer which further protects the surface of the roofing material.

Abstract: An architectural material comprising a bulk polymeric foam material which includes additional structural support which provides increased strength and durability at the front surface of the architectural material. The architectural material includes a mesh material which is disposed near the front surface of the architectural material. The architectural material may additionally include a barrier layer which further protects the surface of the architectural material.

Abstract: A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.

Abstract: An apparatus and process for protecting metal from oxidation during metal forming operations. A salt is deposited onto at least a portion of a surface of the metal. The salt is heated in a protective environment until the salt melts on the metal to form a coated metal. The protective environment may then be removed and the coated metal may be exposed to an active environment. The coated metal may then be formed using standard metal forming processes. In alternative embodiments salts are selected for particular melting and vaporizing temperatures. An automated apparatus for coating a metal object with a salt may be provided. An applicator is configured to deposit the salt onto a surface of the metal object to form a salted metal object. A furnace is configured to receive the salted metal object and to melt at least a portion of the salt on the surface of the salted metal object.

Abstract: An integrated circuit structure (8) includes a plurality of solid state electronic devices and a plurality of conductive elements (12, 14) that electrically couple the electronic devices. The integrated circuit structure (8) also includes a dielectric layer (16) positioned between two or more of the conductive elements (12, 14). A liner (18) is positioned between at least a portion of the dielectric layer (16) and a conductive element (12, 14). The liner (18) is formed from a compound that includes silicon and either carbon and nitrogen.

Abstract: An integrated circuit structure (8) includes a plurality of solid state electronic devices and a plurality of conductive elements (12, 14) that electrically couple the electronic devices. The integrated circuit structure (8) also includes a dielectric layer (16) positioned between two or more of the conductive elements (12, 14). A liner (18) is positioned between at least a portion of the dielectric layer (16) and a conductive element (12, 14). The liner (18) is formed from a compound that includes silicon and either carbon and nitrogen.

Abstract: A carpenter's tool holder to be supported from a wearer's waist belt and including a pocket for supporting and containing therein a tape rule device and a retention member connected within the pocket for interlocking engagement with the spring clip member attached to the rear surface of the tape rule device for preventing unintentioned dislodgment of the tape rule device from the pocket. A second embodiment includes below the pocket an elongated hanger member pivotally connected to the tool holder for supporting and containing a hammer and wherein the elongated hanger member has at its free end a tool loop defining therein an opening through which the handle of the hammer is inserted.