Patents by Inventor Steven W. Taatjes

Steven W. Taatjes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6716334
    Abstract: A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: April 6, 2004
    Assignee: Novellus Systems, Inc
    Inventors: Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini, Evan E. Patton
  • Patent number: 6214193
    Abstract: A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: April 10, 2001
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini, Evan E. Patton
  • Patent number: 6167893
    Abstract: A dynamic chuck for holding a semiconductor wafer or other substrate includes a plurality of clamping arms mounted radially about a central axis of rotation of the wafer or other substrate. Each of the arms is mounted such that it is free to pivot about a horizontal axis. As the chuck rotates the substrate, a centrifugal force acts on each of the arms, causing it to pivot about its axis of rotation and thereby forcing a holding surface of the arm against a peripheral edge of the substrate. The dynamic chuck is applicable to any type of device in which a semiconductor wafer or other substrate must be held in a centered positioned while it is being spun, including wafer cleaning and rinsing apparatus.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: January 2, 2001
    Assignee: Novellus Systems, Inc.
    Inventors: Steven W. Taatjes, John F. Ostrowski
  • Patent number: 6099702
    Abstract: A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: August 8, 2000
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini, Evan E. Patton
  • Patent number: 4389296
    Abstract: A contact for making electrical connections to a moving strip of metal, so as to permit plating the strip, in which grooved members engage just the edges of the strip, thus avoiding scratches on the face of the strip.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: June 21, 1983
    Assignee: National Semiconductor Corporation
    Inventors: Michael Seyffert, Steven W. Taatjes
  • Patent number: 3940906
    Abstract: A supply of hose-shaped wrapping material is pleated axially and fits telescopically about the outer surface of a forming tube. A portion of the wrapping material extends over the upper rim of the tube and downwardly through the tube bore to a position below the lower rim of the tube where it is fastened in a tightly gathered together manner. A gate, positioned below the lower rim of the tube, supports articles fed into the wrapping material in the tube bore. This gate is movable to a position which allows the articles and wrapping material to drop downwardly through the bore to a position below the gate. Such downward movement of the wrapping material draws another portion of wrapping material into the bore of the forming tube.
    Type: Grant
    Filed: November 4, 1974
    Date of Patent: March 2, 1976
    Assignee: FMC Corporation
    Inventors: Lee M. Leckband, Steven W. Taatjes