Patents by Inventor Steven Wakefield

Steven Wakefield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12285760
    Abstract: The present invention relates to an analytical device and reaction chamber therefor. Specifically it relates to a device comprising a chamber with lobes configured such that altering the lobe configuration aids in the analytical interrogation of a portion of the fluid within the chamber.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: April 29, 2025
    Assignee: PROLIGHT DIAGNOSTICS AB
    Inventors: Ben Metcalf, Steven Wakefield, Neil Pollock
  • Publication number: 20220244267
    Abstract: The present invention relates to a method of preparing a sample for subsequent use in a diagnostic or analytical assay by concentrating the target analyte and/or removing interfering factors from the sample matrix. The present invention also relates to a fluidic device comprising a capture and release system connected to an immunodetection system.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 4, 2022
    Applicant: PROLIGHT DIAGNOSTICS AB
    Inventors: Ben Metcalf, Steven Wakefield, Hans Hoppe, Wenshu Xu, Keiko Yata, Cara Deal
  • Publication number: 20220241788
    Abstract: The present invention relates to an analytical device and reaction chamber therefor. Specifically it relates to a device comprising a chamber with lobes configured such that altering the lobe configuration aids in the analytical interrogation of a portion of the fluid within the chamber.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 4, 2022
    Applicant: PROLIGHT DIAGNOSTICS AB
    Inventors: Ben Metcalf, Steven Wakefield, Neil Pollock
  • Patent number: 6790057
    Abstract: A connector for board-to-board and board-to-device interconnect applications includes a plurality of conductive elastomeric columnar contacts arranged in a contact array and retained in a first plurality of openings in an insulative substrate and a plurality of stops retained in a second plurality of openings in the insulative substrate. The stops are dispersed among the contacts of the contact array or positioned on the periphery of the contact array and located in non-abutting relation with respect to adjacent contacts. The contacts and the stops have opposing end surfaces and the end surfaces of the contacts are located a greater distance from the substrate than the end surfaces of the stops such that the stops limit the compression of the elastomeric contacts when the connector is disposed in its intended mounting orientation.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: September 14, 2004
    Assignee: Tyco Electronics Corporation
    Inventors: Stephen D. DelPrete, Steven Wakefield, Peter D. Wapenski
  • Publication number: 20040110401
    Abstract: A connector for board-to-board and board-to-device interconnect applications includes a plurality of conductive elastomeric columnar contacts arranged in a contact array and retained in a first plurality of openings in an insulative substrate and a plurality of stops retained in a second plurality of openings in the insulative substrate. The stops are dispersed among the contacts of the contact array or positioned on the periphery of the contact array and located in non-abutting relation with respect to adjacent contacts. The contacts and the stops have opposing end surfaces and the end surfaces of the contacts are located a greater distance from the substrate than the end surfaces of the stops such that the stops limit the compression of the elastomeric contacts when the connector is disposed in its intended mounting orientation.
    Type: Application
    Filed: October 16, 2003
    Publication date: June 10, 2004
    Applicant: Tyco Electronics Corporation
    Inventors: Stephen D. DelPrete, Steven Wakefield, Peter D. Wapenski
  • Patent number: 6293810
    Abstract: A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: September 25, 2001
    Assignee: Thomas & Betts International, Inc.
    Inventors: Jonathan W. Goodwin, Stephen DelPrete, Steven Wakefield