Patents by Inventor Steven Xunhu Dai

Steven Xunhu Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8593237
    Abstract: The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: November 26, 2013
    Assignee: Sandia Corporation
    Inventor: Steven Xunhu Dai