Patents by Inventor Steven Y. Yu
Steven Y. Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230324322Abstract: A thermal management system includes a housing having an interior space; a heat-generating component disposed within the interior space; a working fluid disposed within the interior space such that the heat-generating component contacts a liquid phase of the working fluid; and a sensing mechanism configured to detect the presence of one or more organic contaminants in the working fluid at concentrations of 100 ppm or less.Type: ApplicationFiled: September 15, 2021Publication date: October 12, 2023Inventors: Phillip E. Tuma, Steven Y. Yu
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Publication number: 20230235200Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.Type: ApplicationFiled: March 24, 2023Publication date: July 27, 2023Inventors: Jeongwan Choi, Jeffrey W. McCutcheon, Marina M. Kaplun, Steven Y. Yu, Jinbae Kim
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Patent number: 11648761Abstract: A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.Type: GrantFiled: April 15, 2019Date of Patent: May 16, 2023Assignee: 3M Innovative Properties CompanyInventors: Larry S. Hebert, Timothy D. Norum, Steven Y. Yu, Stephen P. Maki
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Publication number: 20230110790Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.Type: ApplicationFiled: November 22, 2022Publication date: April 13, 2023Inventors: Jeongwan Choi, Jeffrey W. McCutcheon, Marina M. Kaplun, Steven Y. Yu, Jinbae Kim
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Patent number: 11293111Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.Type: GrantFiled: June 13, 2016Date of Patent: April 5, 2022Assignee: 3M Innovative Properties CompanyInventors: Steven Y. Yu, Gene B. Nesmith, Larry S. Hebert
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Publication number: 20210310145Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 ?m, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.Type: ApplicationFiled: June 16, 2021Publication date: October 7, 2021Inventors: Larry S. Hebert, David A. Sowatzke, Steven Y. Yu, Gene B. Nesmith
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Patent number: 11066753Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 ?m, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.Type: GrantFiled: June 13, 2016Date of Patent: July 20, 2021Assignee: 3M Innovative Properties CompanyInventors: Larry S. Hebert, David A. Sowatzke, Steven Y. Yu, Gene B. Nesmith
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Publication number: 20210187927Abstract: A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.Type: ApplicationFiled: April 15, 2019Publication date: June 24, 2021Inventors: Larry S. Hebert, Timothy D. Norum, Steven Y. Yu, Stephen P. Maki
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Publication number: 20200017623Abstract: The disclosure relates to compositions, methods of applying such compositions, and methods for curing such compositions to a depth of cure of up to about 30 mm within about 0.5 second to about two minutes per light exposure area.Type: ApplicationFiled: March 8, 2018Publication date: January 16, 2020Inventors: Sheng Ye, Ying Lin, Michael E. Griffin, Dennis R. Keicher, Jay S. Schlechte, Paul J. Homnick, Richard S. Smith, Thomas P. Klun, Richard J. Pokorny, Steven Y. Yu, Patricia M. Savu, Michael A. Kropp, Ian Dailey, Charlie P. Blackwell
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Publication number: 20180347059Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.Type: ApplicationFiled: June 13, 2016Publication date: December 6, 2018Inventors: Steven Y. Yu, Gene B. Nesmith, Larry S. Hebert
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Publication number: 20180187323Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 ?m, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.Type: ApplicationFiled: June 13, 2016Publication date: July 5, 2018Inventors: Larry S. Hebert, David A. Sowatzke, Steven Y. Yu, Gene B. Nesmith
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Publication number: 20160010205Abstract: This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of titanium. In addition methods of making such materials are provided that include steps of: optionally exposing a fluoroelastomer material to an oxygen plasma, applying a layer of titanium metal to a fluoroelastomer material by a vapor coating method, applying a metal overlayer to the fluoroelastomer material by a vapor coating method, and optionally electroplating the fluoroelastomer material with a metal top layer.Type: ApplicationFiled: September 21, 2015Publication date: January 14, 2016Inventors: Gene B. Nesmith, Steven Y. Yu
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Publication number: 20150010772Abstract: This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of titanium.Type: ApplicationFiled: December 26, 2012Publication date: January 8, 2015Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Gene B. Nesmith, Steven Y. Yu
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Patent number: 8829928Abstract: Methods and devices are disclosed which can provide an indication of oil quality by measuring a capacitive property of the oil. The methods and/or devices may use a sample acquisition probe comprising a microvolume oil acquisition basin with a capacitive sensing element that is located on the floor of the basin and that is laterally bounded by an oleophilic wetting feature. The methods may involve immersing a sample acquisition probe at least partially into a supply of oil and withdrawing the probe from the supply of oil such that a microvolume oil sample is retained within a microvolume oil acquisition basin of the probe, and measuring a capacitive property of the microvolume oil sample with a capacitive sensing element that is located in the basin.Type: GrantFiled: September 8, 2011Date of Patent: September 9, 2014Assignee: 3M Innovative Properties CompanyInventors: Bernard A. Gonzalez, Abolghassem B. Mahmoodi, Steven Y. Yu
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Patent number: 8564310Abstract: Methods and devices for evaluating the quality of oils are disclosed. The methods and devices can provide an indication of the oil quality based on the Total Polar Content of the oil. The methods rely on a reusable capacitive sensing element that comprises a fluorinated barrier coating, as disclosed herein.Type: GrantFiled: August 18, 2009Date of Patent: October 22, 2013Assignee: 3M Innovative Properties CompanyInventors: Steven Y. Yu, Justin A. Riddle, Naiyong Jing
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Publication number: 20120062251Abstract: Methods and devices are disclosed which can provide an indication of oil quality by measuring a capacitive property of the oil. The methods and/or devices may use a sample acquisition probe comprising a microvolume oil acquisition basin with a capacitive sensing element that is located on the floor of the basin and that is laterally bounded by an oleophilic wetting feature. The methods may involve immersing a sample acquisition probe at least partially into a supply of oil and withdrawing the probe from the supply of oil such that a microvolume oil sample is retained within a microvolume oil acquisition basin of the probe, and measuring a capacitive property of the microvolume oil sample with a capacitive sensing element that is located in the basin.Type: ApplicationFiled: September 8, 2011Publication date: March 15, 2012Inventors: Bernard A. Gonzalez, Abolghassem B. Mahmoodi, Steven Y. Yu
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Publication number: 20110043224Abstract: Methods and devices for evaluating the quality of oils are disclosed. The methods and devices can provide an indication of the oil quality based on the Total Polar Content of the oil. The methods rely on a reusable capacitive sensing element that comprises a fluorinated barrier coating, as disclosed herein.Type: ApplicationFiled: August 18, 2009Publication date: February 24, 2011Inventors: Steven Y. Yu, Justin A. Riddle, Naiyong Jing
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Patent number: 7877009Abstract: A method and system of measuring the spectroscopic impedance of a sensor and its immediate surroundings. The sensor is disposed on an engineered structure and is coated with a protective coating. The method includes providing a first optical signal having a first modulation frequency and amplitude. The method also includes transmitting the first optical signal and a second optical signal from a first location to a sensor location. The method also includes modulating the second optical signal with a second modulation frequency and amplitude, the second modulation frequency and amplitude converted from the first optical signal. The method also includes comparing the first modulation frequency to the second modulation frequency to determine one of a phase difference and a time lag and calculating the electrochemical impedance spectroscopy of the sensor and its immediate surroundings as a function of frequency.Type: GrantFiled: December 20, 2007Date of Patent: January 25, 2011Assignee: 3M Innovative Properties CompanyInventors: Ding Wang, Steven Y. Yu, Gary A. Shreve
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Publication number: 20090162076Abstract: A method and system of measuring the spectroscopic impedance of a sensor and its immediate surroundings. The sensor is disposed on an engineered structure and is coated with a protective coating. The method includes providing a first optical signal having a first modulation frequency and amplitude. The method also includes transmitting the first optical signal and a second optical signal from a first location to a sensor location. The method also includes modulating the second optical signal with a second modulation frequency and amplitude, the second modulation frequency and amplitude converted from the first optical signal. The method also includes comparing the first modulation frequency to the second modulation frequency to determine one of a phase difference and a time lag and calculating the electrochemical impedance spectroscopy of the sensor and its immediate surroundings as a function of frequency.Type: ApplicationFiled: December 20, 2007Publication date: June 25, 2009Inventors: Ding Wang, Steven Y. Yu, Gary A. Shreve
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Patent number: 7504834Abstract: A detection system for monitoring an engineered structure includes an array of sensors disposable in a predetermined pattern on the engineered structure and disposable between a surface of the engineered structure and a protective coating substantially covering the surface. The detection system also includes a controller in communication with the array of sensors for retrieving data from the sensors. The controller communicates with the sensor array via an optical fiber backbone. The array of sensors can remotely provide data corresponding to at least one of a degree of cure of the protective coating, a health of the cured protective coating, and a corrosion rate of the engineered structure at each of the sensors.Type: GrantFiled: December 20, 2006Date of Patent: March 17, 2009Assignee: 3M Innovative Properties CompanyInventors: Ding Wang, Steven Y. Yu