Patents by Inventor Steven Zeilinger
Steven Zeilinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220279656Abstract: A method of forming a molded interconnect device (MID) is provided. The method includes the steps of performing a molding stage, performing a circuit forming stage, and performing a plate stage. As a part of the molding stage, a palladium-catalyzed material is injection molded into a palladium-catalyzed substrate of a desired shape. As a part of the circuit forming stage, both a metallization step and a circuit patterning step are performed. As a part of the plating stage, both an electrolytic plating step and a circuit isolation step are performed.Type: ApplicationFiled: May 20, 2022Publication date: September 1, 2022Applicant: Molex, LLCInventors: Tsuey Choo CHANG, Steven ZEILINGER, Hyun-Jong KO, Patrick RILEY, SukMin KANG
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Patent number: 11357112Abstract: In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.Type: GrantFiled: July 5, 2017Date of Patent: June 7, 2022Assignee: Molex, LLCInventors: Tsuey Choo Chang, Steven Zeilinger, Hyun-Jong Ko, Patrick Riley, SukMin Kang
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Patent number: 11347948Abstract: A payment reader is provided for use in a payment system. The payment reader includes a housing, a non-conductive cover covering the housing and forming an internal compartment, electronic circuitry within the internal compartment and surrounded by the cover, and a mesh of conductive traces provided on the cover and in communication with the electronic circuitry. The cover has an upper wall and interconnected side walls depending downwardly from the upper wall. The lower surface of the upper wall which faces the internal compartment has its entire surface area which is formed of at least one three-dimensional shape which extends outwardly from an x-y plane in the z-direction.Type: GrantFiled: March 29, 2018Date of Patent: May 31, 2022Assignee: Molex, LLCInventors: Tsuey Choo Lily Chang, Yan Pan, Steven Zeilinger
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Publication number: 20210303805Abstract: A payment reader is provided for use in a payment system. The payment reader includes a housing, a non-conductive cover covering the housing and forming an internal compartment, electronic circuitry within the internal compartment and surrounded by the cover, and a mesh of conductive traces provided on the cover and in communication with the electronic circuitry. The cover has an upper wall and interconnected side walls depending downwardly from the upper wall. The lower surface of the upper wall which faces the internal compartment has its entire surface area which is formed of at least one three-dimensional shape which extends outwardly from an x-y plane in the z-direction.Type: ApplicationFiled: March 29, 2018Publication date: September 30, 2021Applicant: Molex, LLCInventors: Tsuey Choo Lily CHANG, Yan PAN, Steven ZEILINGER
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Publication number: 20190166698Abstract: In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.Type: ApplicationFiled: July 5, 2017Publication date: May 30, 2019Applicant: Molex, LLCInventors: Tsuey Choo CHANG, Steven ZEILINGER, Hyun-Jong KO, Patrick RILEY, SukMin KANG
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Patent number: 9711903Abstract: A connector is provided that includes an RFID circuit. Before the connector is mated with a corresponding connector the RFID circuit is tuned so that it does not function in a desired manner at a desired frequency. Once the connector is mated the tuning of the RFID circuit is modified so that the RFID circuit functions in the desired manner at the desired frequency.Type: GrantFiled: March 19, 2015Date of Patent: July 18, 2017Assignee: Molex, LLCInventors: Lily T. C. Chang, Timothy Gagnon, Steven Zeilinger
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Publication number: 20170077650Abstract: A connector is provided that includes an RFID circuit. Before the connector is mated with a corresponding connector the RFID circuit is tuned so that it does not function in a desired manner at a desired frequency. Once the connector is mated the tuning of the RFID circuit is modified so that the RFID circuit functions in the desired manner at the desired frequency.Type: ApplicationFiled: March 19, 2015Publication date: March 16, 2017Applicant: Molex, LLCInventors: Lily T.C. Chang, Timothy GAGNON, Steven ZEILINGER
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Publication number: 20030189522Abstract: A multiple frequency band antenna is capable of operating in at least three distinct preselected frequency bands. The antenna includes a planar inverted F antenna (PIFA) extending horizontally, a ground leg and feed leg integrally formed therewith and extending at an angle to the PIFA. The PIFA includes a slot formed therein that separates the PIFA into an inner base portion and outer branch portion, the outer branch portion extending from one end of the base portion extending from one end of the base portion and at least partially around a perimeter of the base portion. The antenna includes a horizontal conductive element extending from the ground leg and interposed between the PIFA and associated ground plane, and the horizontal element defines an additional, or third radiating element of the antenna, which broadens the bandwidth of the antenna.Type: ApplicationFiled: April 4, 2003Publication date: October 9, 2003Inventor: Steven Zeilinger
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Publication number: 20030080916Abstract: An antenna comprising a center-fed coaxial dipole having a first element, configured as a whip and a second element having a first and second portion for transmitting/receiving in dual frequency bands. The first element, first portion and second portion having a length equal to one-quarter wavelength of the mid-range frequency of the frequency band. The first portion configured as an inner conductive cylindrical sleeve coaxially aligned with the whip. The second portion, an outer conductive cylindrical sleeve, coaxially aligned with inner sleeve. A coaxial conductor having an inner conductor electrically connected to the whip and an outer conductor connected to the second element. A coaxial choke axially aligned with the conductor, having a length of one-quarter wavelength of the mid-range frequency band, a first end of the choke connected to the outer conductor and a second end being spaced from the second element an equivalent distance as the choke length.Type: ApplicationFiled: October 30, 2001Publication date: May 1, 2003Inventors: Steven Zeilinger, Felipe Zuniga
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Patent number: 6552692Abstract: An antenna comprising a center-fed coaxial dipole having a first element, configured as a whip and a second element having a first and second portion for transmitting/receiving in dual frequency bands. The first element, first portion and second portion having a length equal to one-quarter wavelength of the mid-range frequency of the frequency band. The first portion configured as an inner conductive cylindrical sleeve coaxially aligned with the whip. The second portion, an outer conductive cylindrical sleeve, coaxially aligned with inner sleeve. A coaxial conductor having an inner conductor electrically connected to the whip and an outer conductor connected to the second element. A coaxial choke axially aligned with the conductor, having a length of one-quarter wavelength of the mid-range frequency band, a first end of the choke connected to the outer conductor and a second end being spaced from the second element an equivalent distance as the choke length.Type: GrantFiled: October 30, 2001Date of Patent: April 22, 2003Assignee: Andrew CorporationInventors: Steven Zeilinger, Felipe Zuniga
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Patent number: 6421018Abstract: A coupler for use in wireless communications systems that is particularly useful in broadband applications includes a pair of coupling elements that are mounted on the interior and exterior surfaces of a vehicle, such as a rear window. Both coupling elements have dielectric substrates mounted within housings and each of the substrates includes a dual “bowtie” arrangement. This arrangement includes a first bowtie that is etched onto the substrate to remove the conductive upper layer and a second bowtie formed of conductive material and positioned within the first bowtie and spaced apart from its boundaries so as to define a slot separating the two.Type: GrantFiled: May 31, 2001Date of Patent: July 16, 2002Assignee: Andrew CorporationInventors: Steven Zeilinger, Will Darden
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Patent number: D1016072Type: GrantFiled: May 24, 2022Date of Patent: February 27, 2024Assignee: Molex, LLCInventors: Luis Ramses Rubio Romero, Jorge Leonel Flores Galvan, Steven Zeilinger
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Patent number: D1016817Type: GrantFiled: May 24, 2022Date of Patent: March 5, 2024Assignee: Molex, LLCInventors: Luis Ramses Rubio Romero, Jorge Leonel Flores Galvan, Steven Zeilinger
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Patent number: D1016818Type: GrantFiled: May 24, 2022Date of Patent: March 5, 2024Assignee: Molex, LLCInventors: Luis Ramses Rubio Romero, Jorge Leonel Flores Galvan, Steven Zeilinger
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Patent number: D1016819Type: GrantFiled: May 24, 2022Date of Patent: March 5, 2024Assignee: Molex, LLCInventors: Luis Ramses Rubio Romero, Jorge Leonel Flores Galvan, Steven Zeilinger