Patents by Inventor Steven Zuniga
Steven Zuniga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050037698Abstract: A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.Type: ApplicationFiled: September 20, 2004Publication date: February 17, 2005Inventors: Steven Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
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Publication number: 20050020185Abstract: Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.Type: ApplicationFiled: July 6, 2004Publication date: January 27, 2005Inventors: Steven Zuniga, Manoocher Birang
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Patent number: 6776692Abstract: Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.Type: GrantFiled: July 5, 2000Date of Patent: August 17, 2004Assignee: Applied Materials Inc.Inventors: Steven Zuniga, Manoocher Birang
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Patent number: 6705932Abstract: A carrier head for a chemical mechanical polishing apparatus includes a base and a flexible membrane extending beneath the base to define a pressurizable chamber. The flexible membrane may be secured to the base, to a retaining ring surrounding the mounting surface, or to a support structure movably connected to the base by, for example, an adhesive, an O-ring seal, a sealant, or by fitting the membrane into a recess. A lower surface of the flexible membrane provides a mounting surface for a substrate.Type: GrantFiled: September 20, 2000Date of Patent: March 16, 2004Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen
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Publication number: 20040033762Abstract: A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower surface of the flexible membrane when the first chamber is evacuated, the valve is actuated to generate a signal to the substrate detection system.Type: ApplicationFiled: August 12, 2003Publication date: February 19, 2004Applicant: Applied Materials, Inc., a Delaware corporationInventors: Hung Chih Chen, Ming Kuei Tseng, Steven Zuniga
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Patent number: 6663466Abstract: A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower surface of the flexible membrane when the first chamber is evacuated, the valve is actuated to generate a signal to the substrate detection system.Type: GrantFiled: November 17, 1999Date of Patent: December 16, 2003Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Ming Kuei Tseng, Steven Zuniga
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Patent number: 6575825Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: January 12, 2001Date of Patent: June 10, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Patent number: 6572446Abstract: A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.Type: GrantFiled: September 18, 2000Date of Patent: June 3, 2003Assignee: Applied Materials Inc.Inventors: Thomas H. Osterheld, Manoocher Birang, Robert D. Tolles, Steven Zuniga, Charles C. Garretson
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Patent number: 6514124Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.Type: GrantFiled: October 20, 2000Date of Patent: February 4, 2003Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen, Manoocher Birang
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Patent number: 6406361Abstract: A carrier head for a chemical mechanical polishing apparatus includes a base, a flexible membrane extending beneath the base to provide a mounting surface for a substrate, and a retaining ring surrounding the mounting surface. An edge portion of the flexible membrane extends around an outer surface of a support structure. An outer surface of the support structure is tapered to reduce binding between the flexible membrane and the retaining ring. Alternately, there may be a relatively wide gap between the support structure and the retaining ring, or a sidewall portion of the flexible membrane may be reinforced.Type: GrantFiled: October 20, 2000Date of Patent: June 18, 2002Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen
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Patent number: 6361420Abstract: A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.Type: GrantFiled: February 8, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen, Gopalakrishna B. Prabhu
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Patent number: 6277014Abstract: A carrier head for a chemical mechanical polishing apparatus has a base, a flexible membrane extending beneath the base to define a pressurizable chamber, a support structure positioned in the chamber, and a spacer ring positioned outside the chamber. The flexible membrane includes a lower surface of the flexible membrane provides a mounting surface for a substrate, and a perimeter portion that extends in a serpentine path between the spacer ring the support structure.Type: GrantFiled: October 9, 1998Date of Patent: August 21, 2001Assignee: Applied Materials, Inc.Inventors: Hung Chen, Steven Zuniga
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Publication number: 20010008830Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: ApplicationFiled: January 12, 2001Publication date: July 19, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Patent number: 6217426Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: April 6, 1999Date of Patent: April 17, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Patent number: 6165058Abstract: A carrier head for a chemical mechanical polishing apparatus includes a base, a flexible membrane extending beneath the base to provide a mounting surface for a substrate, and a retaining ring surrounding the mounting surface. An edge portion of the flexible membrane extends around an outer surface of a support structure. An outer surface of the support structure is tapered to reduce binding between the flexible membrane and the retaining ring. Alternately, there may be a relatively wide gap between the support structure and the retaining ring, or a sidewall portion of the flexible membrane may be reinforced.Type: GrantFiled: December 9, 1998Date of Patent: December 26, 2000Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen
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Patent number: 6162116Abstract: A carrier head for a chemical mechanical polishing apparatus includes a base and a flexible membrane extending beneath the base to define a pressurizable chamber. The flexible membrane may be secured to the base, to a retaining ring surrounding the mounting surface, or to a support structure movably connected to the base by, for example, an adhesive, an O-ring seal, a sealant, or by fitting the membrane into a recess. A lower surface of the flexible membrane provides a mounting surface for a substrate.Type: GrantFiled: January 23, 1999Date of Patent: December 19, 2000Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen
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Patent number: 6159079Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.Type: GrantFiled: September 8, 1998Date of Patent: December 12, 2000Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen, Manoocher Birang
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Patent number: 6132298Abstract: A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.Type: GrantFiled: November 25, 1998Date of Patent: October 17, 2000Assignee: Applied Materials, Inc.Inventors: Steven Zuniga, Hung Chen, Gopalakrishna B. Prabhu