Patents by Inventor Stewart Dunlap

Stewart Dunlap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package with pre-applied underfill and associated methods
    Patent number: 6927097
    Abstract: An underfill material is applied to an electronic component, such as a die, integrated circuit (IC) package, or printed circuit board, prior to mounting of the component upon another packaging element. In an embodiment, the component may be a singulated IC package. Strips of underfill material may be separated from a supply reel and applied to the edges of the IC package. Trays may convey the components to and from automated underfill attach equipment. Assembly methods, as well as application of the package to an electronic assembly and to an electronic system, are also described.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: August 9, 2005
    Assignee: Intel Corporation
    Inventor: Stewart Dunlap
  • Package with pre-applied underfill and associated methods
    Publication number: 20040188131
    Abstract: An underfill material is applied to an electronic component, such as a die, integrated circuit (IC) package, or printed circuit board, prior to mounting of the component upon another packaging element. In an embodiment, the component may be a singulated IC package. Strips of underfill material may be separated from a supply reel and applied to the edges of the IC package. Trays may convey the components to and from automated underfill attach equipment. Assembly methods, as well as application of the package to an electronic assembly and to an electronic system, are also described.
    Type: Application
    Filed: March 27, 2003
    Publication date: September 30, 2004
    Applicant: Intel Corporation
    Inventor: Stewart Dunlap