Abstract: A method for manufacturing a distributed feedback reflector comprises forming a waveguide (32) on a wafer, applying a photoresistive material to the wafer, forming a grating on the photoresistive material, developing the photoresistive material, and milling the substrate to form the distributed feedback reflector.

Abstract: A method of repairing an area of metallization that has lifted from a circuit board substrate uses a dry film epoxy placed between the lifted metallization and the substrate. Downward pressure and heat are simultaneously applied to the lifted area to rebond it to the substrate. Both metallization pads and traces may be repaired with the method, and the resulting bond may be stronger than that originally present. When heated, the dry film epoxy will melt and cure very quickly, requiring no further processing. The method is particularly useful when repairing circuit boards intended for microwave circuitry, in which conductive ribbons are gap welded to metallization pads. A metallization pad repair operation may be combined with a ribbon attachment operation, accomplishing both with one gap welding operation. The gap welder provides the downward force and heat necessary to bond the ribbon and repair the lifted pad.

Abstract: A hermetically sealed integrated wafer wherein the integrated wafer is sandwiched between a support layer and expansion buffering layer. The expansion buffering layer includes a centrally-located opening through which integrated circuits located on the wafer may extend. A sealing ring and cover plate are bonded to the expansion buffering layer to provide hermetic sealing of integrated circuits or other electronic elements located on the wafer.

Abstract: Process for electrically connecting non-planar electronic elements to a motherboard. A radiation sensitive metallic conversion compound is applied as a coating which extends at least between electrical connection sites on the electronic element and motherboard. The metallic conversion coating is then selectively irradiated by laser to convert the coating into a metallic electrical connection which extends between the non-planar electronic element and motherboard.