Abstract: An optical amplification device includes a depolarizer for reducing the polarization sensitivity requirements on an SOA by changing the input to the SOA from having an arbitrary (unknown) polarization state to a known (depolarized) state. The depolarizer receives an input optical signal and outputs a depolarized, optical signal, and a semiconductor optical amplifier (SOA) for receives the depolarized optical signal and outputs an amplified optical signal.

Abstract: An optical alignment device is provided comprising a base portion extending the length of the alignment device, a substantially horizontal package mounting portion coupled to the base portion, and a component retaining portion coupled to the base portion.

Abstract: A substrate comprising, for example, a copper-beryllium oxide ceramic-copper sandwich permits a laser diode along with cooperative components to be soldered in place using a high temperature solder. The sandwich structure is operative to move the effective thermal properties of the copper more towards that of the beryllium oxide thus reducing, for example, any stress which might occur between the solder, the substrate, and the laser diode. The use of high temperature solder provides for significantly improved operation.

Abstract: Semiconductor laser diodes or diode bars are assembled into stacks by a method which permits testing of an entire stack at once and which uses only high temperature solder. The stack includes a plurality of submounts which resemble elongated bars which are square in cross section. Laser diodes (or diode bars) are sandwiched between adjacent submounts. Each submount has an elongated mesa and the mesas are so shaped and positioned in the stack to form a set of ridges which fit into a set of grooves in a substrate. The diodes are bonded to adjacent submounts in a stack simultaneously by reflowing solder preforms (high temperature) in a reflow oven. The stack is secured in place in the grooves of the substrate by reflowing solder placed at the bottom of the grooves.

Abstract: A plate of metal is bonded to a plate of and electrical insulator and the metal is cut through into a plurality of parallel channels, or recesses, each of a dimension to receive a laser diode (bar). A laser diode is positioned in each of the channels and a solder preform, positioned on the top of the laser diode bars. Is heated to flow around each laser diode bar to secure it in place. A highly manufacturable laser diode assembly having a higher heat capacity results for bonding to a heat sink.