Abstract: A method of manufacturing a skin-compatible electrode (100) comprises printing a circuit pattern (P1) onto a flexible substrate (200) to form an electrically conductive pattern including an electrode pad area (301). A layer of an adhesive composition (401p) is printed in a second pattern (P2) onto the electrode pad area (301) to form an adhesive interface layer (401). The adhesive interface layer (401) is a dry film formed from the adhesive composition (401p) comprising an ionically conductive pressure sensitive adhesive composition comprising a resin (R), an ionic liquid (I), and optionally electrically conductive particles (P). A layer thickness and material of the flexible substrate, the conductive pattern, and the conductive adhesive interface have relatively low stiffness in plane of the flexible substrate (200).

Abstract: The present invention relates to an ionically conductive pressure sensitive adhesive composition useful as an electrode adhesive, which is an ionically conductive (meth)acrylate based pressure sensitive adhesive allowing prolonged biosignal monitoring times without skin irritation and loss of signal quality.

Abstract: The present invention relates to an electrode comprising a conductive pressure sensitive adhesive layer and a conductive layer. Furthermore, the invention refers to a method of manufacturing the electrode and to the use of the electrode for monitoring biosignals.

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: The present invention relates to a heating element, which is integrated into the construction material. Integration of the heating element according to the present invention into the construction material limits space needed for the heating system. In addition, the used heating element provides reduced power consumption compared to conventional technologies. A construction element according to the present invention comprises a construction material, a heating element comprising a foil comprising a PTC composition layer or a PTC composition layer, at least one adhesive layer, a substrate and a connector, wherein said heating element is embedded between said construction material and said substrate, and wherein said PTC layer comprises a semi-crystalline material, at least one binder and an electronically conductive material.

Abstract: A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f??(1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a?0, b?0, c?0, d?0, e?0, f?0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.

Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Abstract: The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Abstract: A curable barrier sealant comprises a curable resin having a cycloaliphatic backbone and a reactive functional group present at a level that provides an equivalent weight of less than 400 grams per mole of reactive functional group.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Abstract: The present invention discloses a one part, snap curing, acrylic-based composition with long worklife at room temperature. The composition cures in less than 60 seconds at temperatures below 120° C. and provides a suitable worklife of 3 days at room temperature. The composition comprise of a radical initiator with a ten hour half life, 10 hr T1/2, equal to or less than 80° C., (meth)acrylate or vinylene-containing base oligomers and at least one additional (meth)acrylate monomer to dilute the base oligomers. Additional ingredients, such as non-reactive chemical compounds, thixotropic agents, pigments, and fillers may be added as desired. A further embodiment of the invention is a method of using the composition with an electronic device.

Abstract: The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.