Abstract: Methods and devices for enhancing mobility of charge carriers. An integrated circuit may include semiconductor devices of two types. The first type of device may include a metallic gate and a channel strained in a first manner. The second type of device may include a metallic gate and a channel strained in a second manner. The gates may include, collectively, three or fewer metallic materials. The gates may share a same metallic material. A method of forming the semiconductor devices on an integrated circuit may include depositing first and second metallic layers in first and second regions of the integrated circuit corresponding to the first and second gates, respectively.

Abstract: A packaging scheme for MEMS device is provided. A method of packaging MEMS device in a semiconductor structure includes forming an insulation fence that surrounds the MEMS device on the semiconductor structure. The method further includes attaching a wafer of dielectric material to the insulation fence. The lid wafer, the insulation fence, and the semiconductor structure enclose the MEMS device.

Abstract: Methods and systems are described for displaying enabling the transmission, formatting, and display of multimedia data after a hot plug event during a start-up dead period. In particular, approaches for transmission, formatting, and display of multimedia data in the absence or non-operation of a hot plug detect system or signal, so that multimedia information can be displayed in a proper format even during the dead period when no hot plug detect signal is received.

Abstract: A boost circuit is used for power factor correction (PFC). In a low power application, transition mode control is utilized. However, switching frequency varies with different input voltages, and over a wide input voltage range, the switching frequency can become too high to be practical. To address this issue, a boost circuit is provided whose effective inductance changes as a function of input voltage. By changing the inductance, control is exercised over switching frequency.

Abstract: The invention relates to systems and methods for spectrum sharing and communication among several wireless communication networks with overlapping service areas (or cells), especially to Wireless Regional Area Networks (WRANs). Particular embodiments of the invention disclose using a conference channel to communicate between base stations. Other embodiments use slotted coexistence windows within frames to transmit and receive information, including for reserving transmission times within subsequent frames.

Abstract: Methods and systems are described for enabling display system data transmission during use. An integrated circuit package includes input interface circuitry configured to receive an audio-video data stream having a video signal and timing information and timing extraction circuitry that can identify blanking patterns for the video signal. The package includes input processing circuitry for receiving audio-video signal and converting the audio-video data stream input into a low voltage differential signal (LVDS). The package includes a timing controller having timing extraction circuitry, a set of symbol buffers, a scheduler, and timing control circuitry. All configured to implement LVDS data transfer and in some implementation enable point to point data transfer from data buffers to associated column drivers.

Abstract: A user presence detection device includes a camera module with a silicon-based image sensor adapted to capture an image and a processing device configured to process the image to detect the presence of a user. The camera module further includes a light filter having a lower cut-off wavelength of between 550 nm and 700 nm and a higher cut-off wavelength of between 900 nm and 1100 nm.

Abstract: The addition of high throughput capability elements to beacon frames and peer link action frames in wireless mesh networks enable the utilization of desirable features without further modifications to the network. Rules can be established for high throughput mesh point protection in a mesh network, Space-time Block Code (STBC) operations and 20/40 MHz operation selections. However, features such as PSMP (power save multi-poll) and PCO (phased coexistence operations) are barred from implementation to prevent collisions.

Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.

Abstract: An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.

Abstract: Disclosed is a programmable pulse width discriminator circuit operable to receive a set of parameters from a user and indicate when an input signal satisfies conditions set by the user-defined parameters. The input signal is sampled by the pulse width discriminator circuit to detect a desired state of the input signal. The user may set the parameters such that the pulse width discriminator indicates the condition wherein the number of consecutive samples for which the input signal is the desired state is (i) greater than a first threshold value, (ii) less than a second threshold value, or (iii) between the first and second threshold values. In these embodiments, the user sets the first and second threshold values and selects which set of conditions are indicated by the output of the circuit.

Abstract: Methods and systems are disclosed for reduced power consumption in communication networks, including sensor networks implemented according to IEEE 802.11ah, by organizing stations into groups having long sleep periods. By organizing the stations of the network into groups, the access point can match each group's traffic identification map with its target beacon transmit time. One embodiment organizes the stations sequentially by AID numbers. Other embodiments organize the stations by similar power save requirements and/or nearby geographical location. Forms of an Extended Traffic Identification Map are matched with an awaken Target Beacon Transmit Time of the group.

Abstract: Methods and systems are disclosed for the operation of wireless communication networks, in which communication channels can have possibly overlapping bandwidths of different sizes, including sensor networks operating by the IEEE 802.11ah standard. A first method of signaling to negotiate the channel bandwidth conveys the needed information in the SIG field of the PPDUs of duplicate RTS/CTS frames, and uses the SIG field of PPDUs of duplicated data, control and management frames to perform transmit opportunity protection. A second method of signaling to negotiate the channel bandwidth conveys the needed information in the scrambling sequence field of PPDUs of duplicate RTS, and uses the scrambling sequence field of PPDUs of duplicated data, control and management frames to perform transmit opportunity protection.

Abstract: Methods and systems are disclosed specifying the arrangement and content of the fields in data and management frames, which allow for greater payload efficiency in frame-based communication networks. The content of the fields is changed from the standard 802.11 arrangement to meet of the needs of networks such as Sub-1GHz networks, including those of the 802.11 ah standard, and sensor networks with a large number of stations transmitting at low data rates. In some embodiments, MAC header fields are reduced from standard 802.11 header fields by using only two fields for addressing and eliminating standard fields that are not used in sensor networks.

Abstract: Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract: In accordance with an embodiment, a network device includes a network controller and at least one network interface coupled to the network controller that includes at least one media access control (MAC) device configured to be coupled to at least one physical layer interface (PHY). The network controller may be configured to determine a network path comprising the at least one network interface that has a lowest power consumption of available media types coupled to the at least one PHY.

Abstract: A support structure includes an internal cavity. An elastic membrane extends to divide the internal cavity into a first chamber and a second chamber. The elastic membrane includes a nanometric-sized pin hole extending there through to interconnect the first chamber to the second chamber. The elastic membrane is formed of a first electrode film and a second electrode film separated by a piezo insulating film. Electrical connection leads are provided to support application of a bias current to the first and second electrode films of the elastic membrane. In response to an applied bias current, the elastic membrane deforms by bending in a direction towards one of the first and second chambers so as to produce an increase in a diameter of the pin hole.

Abstract: An insulating region for a semiconductor wafer and a method of forming same. The insulating region can include a tri-layer structure of silicon oxide, boron nitride and silicon oxide. The insulating region may be used to insulate a semiconductor device layer from an underlying bulk semiconductor substrate. The insulating region can be formed by coating the sides of a very thin cavity with silicon oxide, and filling the remainder of the cavity between the silicon oxide regions with boron nitride.

Abstract: An electronic system, an integrated circuit and a method for display are disclosed. The electronic system contains a first device, a memory and a video/audio compression/decompression device such as a decoder/encoder. The electronic system is configured to allow the first device and the video/audio compression/decompression device to share the memory. The electronic system may be included in a computer in which case the memory is a main memory. Memory access is accomplished by one or more memory interfaces, direct coupling of the memory to a bus, or direct coupling of the first device and decoder/encoder to a bus. An arbiter selectively provides access for the first device and/or the decoder/encoder to the memory based on priority. The arbiter may be monolithically integrated into a memory interface. The decoder may be a video decoder configured to comply with the MPEG-2 standard. The memory may store predicted images obtained from a preceding image.