Patents by Inventor STMicroelectronics Pte Ltd.

STMicroelectronics Pte Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED WAFER LEVEL BALL GRID ARRAY BAR SYSTEMS AND METHODS
    Publication number: 20130168858
    Abstract: A bar formed from a reconstituted wafer and containing one or more conductive material filled voids is used to electrically and physically connect the top and bottom packages in a package-on-package (PoP) package. The bar is disposed in the fan out area of the lower package forming the PoP package.
    Type: Application
    Filed: December 20, 2012
    Publication date: July 4, 2013
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventor: STMicroelectronics Pte Ltd.
  • WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
    Publication number: 20130119282
    Abstract: An optical detection sensor and method of forming same. The optical detection sensor be a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 16, 2013
    Applicant: STMicroelectronics Pte Ltd.
    Inventor: STMicroelectronics Pte Ltd.