Patents by Inventor STMICROELECTRONICS (ROUSSET) SAS

STMICROELECTRONICS (ROUSSET) SAS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130201347
    Abstract: A user presence detection device includes a camera module with a silicon-based image sensor adapted to capture an image and a processing device configured to process the image to detect the presence of a user. The camera module further includes a light filter having a lower cut-off wavelength of between 550 nm and 700 nm and a higher cut-off wavelength of between 900 nm and 1100 nm.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 8, 2013
    Applicants: STMICROELECTRONICS, INC., STMICROELECTRONICS (ROUSSET) SAS
    Inventors: STMicroelectronics (Rousset) SAS, STMicroelectronics, Inc.
  • Publication number: 20130200484
    Abstract: A process for manufacturing an SOI wafer, including the steps of: forming, in a wafer of semiconductor material, cavities delimiting structures of semiconductor material; thinning out the structures through a thermal process; and completely oxidizing the structures.
    Type: Application
    Filed: November 21, 2012
    Publication date: August 8, 2013
    Applicant: STMicroelectronics S.r.l.
    Inventor: STMicroelectronics S.r.l.
  • Publication number: 20130200371
    Abstract: A device for detecting a laser attack in an integrated circuit chip formed in the upper P-type portion of a semiconductor substrate incorporating an NPN bipolar transistor having an N-type buried layer, including a detector of the variations of the current flowing between the base of said NPN bipolar transistor and the substrate.
    Type: Application
    Filed: January 28, 2013
    Publication date: August 8, 2013
    Applicant: STMicroelectronics (Rousset) SAS
    Inventor: STMicroelectronics (Rousset) SAS
  • Publication number: 20130203235
    Abstract: A capped integrated device includes a semiconductor chip, incorporating an integrated device and a protective cap, bonded to the semiconductor chip for protection of the integrated device by means of a bonding layer made of a bonding material. The bonding material forms anchorage elements within recesses, formed in at least one between the semiconductor chip and the protective cap.
    Type: Application
    Filed: March 12, 2013
    Publication date: August 8, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: STMicroelectronics S.r.l.
  • Publication number: 20130202031
    Abstract: A GOP-independent dynamic bit-rate controller system includes a user interface to receive one or more input parameters, a bit-rate controller and an encoder. The bit-rate controller regulates a bit-rate of an output bit-stream. The bit-rate controller includes multiple bit-rate modules to determine a bit-estimate and a quantization parameter, and a control module to calculate a convergence period based on the received input parameters and a frame rate. The control module selects a bit rate module based on the convergence period and the encoder generates the output bit-stream using the quantization parameter determined by the bit rate module.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 8, 2013
    Applicants: STMICROELECTRONICS SRL, STMICROELECTRONICS PVT. LTD.
    Inventors: STMICROELECTRONICS PVT. LTD., STMICROELECTRONICS SRL
  • Publication number: 20130196500
    Abstract: A method for forming a via connecting a first upper level layer to a second lower level layer, both layers being surrounded with an insulating material, the method including the steps of: a) forming an opening to reach an edge of the first layer, the opening laterally continuing beyond said edge; b) forming a layer of a protection material on said edge only; c) deepening said opening by selectively etching the insulating material to reach the second lower level layer; and d) filling the opening with at least one conductive contact material.
    Type: Application
    Filed: January 23, 2013
    Publication date: August 1, 2013
    Applicants: Commissariat a l'Energie Atomique et aux Energies Alternatives, STMicroelectronics S.A.
    Inventors: STMicroelectronics S.A., Commissariat a l'Energie Atomique et aux Energies Alternatives
  • Publication number: 20130198151
    Abstract: An embodiment relates to distributing media over a peer-to-peer network by employing a digital fountain coding. Accordingly, the file is separated into file portions and the portions are combined to obtain encoded portions which are then transmitted. A file portion may form a part of a plurality of the encoded and transmitted file portions. The portions may be pieces and/or blocks of the file, wherein a piece includes a plurality of blocks. An embodiment further provides mechanisms for efficient block-request-transmission approaches in which the initial requests for blocks in the file are transmitted and additional requests for some random blocks are transmitted. The additional requests may be transmitted after each piece or after the entire file blocks have been requested, or both.
    Type: Application
    Filed: January 23, 2013
    Publication date: August 1, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: STMICROELECTRONICS S.R.L.
  • Publication number: 20130193550
    Abstract: A method for manufacturing an integrated circuit, including the steps of forming first transistors on a first semiconductor layer; depositing a first insulating layer above the first semiconductor layer and the first transistors, and leveling the first insulating layer; depositing a conductive layer above the first insulating layer, and covering the conductive layer with a second insulating layer; bonding a semiconductor wafer to the second insulating layer; thinning the semiconductor wafer to obtain a second semiconductor layer; and forming second transistors on the second semiconductor layer.
    Type: Application
    Filed: January 28, 2013
    Publication date: August 1, 2013
    Applicants: Commissariat a l'Energie Atomique et aux Energies Alternatives, STMicroelectronics S.A.
    Inventors: STMicroelectronics S.A., Commissariat a l'Energie Atomique et aux Energies Alternatives
  • Publication number: 20130195235
    Abstract: An apparatus includes a first clock source, a second clock source and circuitry configured to supply a clock signal to a circuit. The circuitry operates to change the clock signal from one frequency to another different frequency. This change is made in a manner whereby no clock signal is supplied during a period of time when the change from the one frequency to the another different clock frequency is being made.
    Type: Application
    Filed: January 17, 2013
    Publication date: August 1, 2013
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limted
    Inventors: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SAS
  • Publication number: 20130193437
    Abstract: An integrated circuit including: a semiconductor substrate of a first conductivity type having at least one well of a second conductivity type laterally delimited, on two opposite walls, by regions of the first conductivity type, defined at its surface; at least one region of the second conductivity type which extends in the semiconductor substrate under the well; and a system for detecting a variation of the substrate resistance between each association of two adjacent regions of the first conductivity type.
    Type: Application
    Filed: January 25, 2013
    Publication date: August 1, 2013
    Applicant: STMICROELECTRONICS (ROUSSET) SAS
    Inventor: STMicroelectronics (Rousset) SAS
  • Publication number: 20130192435
    Abstract: A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.
    Type: Application
    Filed: January 30, 2013
    Publication date: August 1, 2013
    Applicant: STMICROELECTRONICS (TOURS) SAS
    Inventor: STMicroelectronics (Tours) SAS
  • Publication number: 20130194845
    Abstract: A control device of a switching converter controls the closing and opening of a switch of the converter that regulates the operation of an inductor. The control device includes a ramp voltage generator, a switch control circuit configured to close the switch based on a comparison of the ramp voltage with a first signal and a generator control circuit configured to control the ramp voltage generator based on a value of a second signal representative of a current flowing through the inductor of the converter, in comparison with the value of a third signal.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 1, 2013
    Applicants: STMICROELECTRONICS S.R.L., DORA S.P.A.
    Inventors: DORA S.P.A., STMICROELECTRONICS S.R.L.
  • Publication number: 20130196645
    Abstract: A method for personalizing a SIM card may include loading the SIM card on a conveyor belt of a production machine, programming the SIM card, and unloading the programmed SIM card from the conveyor belt. If the intermediate result is wrong, the method may check an intermediate result of the programming and re-program the SIM card.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 1, 2013
    Applicant: STMicroelectronics S.r.I.
    Inventor: STMicroelectronics S.r.I.
  • Publication number: 20130194482
    Abstract: An image sensor is formed by a pixel array and a microlens array. One microlens is associated with each pixel. The microlens is positioned in a manner that is offset from a center of its associated pixel. The positioning offset for the microlens is a combination of a first offset determined as a function of the pixel's position relative to a center of the image sensor and a second offset that is randomly selected (both in terms of distance and radial direction). The random offset provides the effect that the spatial frequency information from the shifted microlens array is randomly distributed so as to provide different spatial frequencies and effectively cancel out Moiré interference.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 1, 2013
    Applicant: STMicroelectronics (Research & Development) Limited
    Inventor: STMicroelectronics (Research & Development) Limited
  • Publication number: 20130194021
    Abstract: An asynchronous level shifter electronic circuit including: a transmitter, which can be coupled to a first voltage and generates a communication signal; a receiver, which can be coupled to a second voltage; and a capacitive coupling stage, which receives the communication signal and supplies a corresponding filtered signal to the receiver. The receiver includes: a threshold device, which has an input terminal and an output terminal and switches an electrical quantity on the output terminal between a first value and a second value, as a function of corresponding transitions through a threshold of a first intermediate signal present on the input terminal, to generate a second intermediate signal; and a biasing circuit, which generates the first intermediate signal to have a d.c. component, which is a function of the second intermediate signal, and superposed on which is a variable component, which is a function of the filtered signal.
    Type: Application
    Filed: January 29, 2013
    Publication date: August 1, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: STMicroelectronics S.r.I.
  • Publication number: 20130194842
    Abstract: A control device controls a switching converter. The converter has an input alternating supply voltage, a regulated direct voltage on the output terminal, and a switch connected to an inductor. The control device controls the closing and opening time period of said switch for each cycle and receives a first input signal representative of the current flowing through one element of the converter. The control device comprises a counter configured to count a time period, a comparator configured to compare said first input signal with a second signal, digital control block configured to control the closing and opening of said switch and to activate said counter to start the counting of said time period when the said first input signal crosses said second signal, with said switch being closed. The digital control block is configured to open the switch when the counter finishes the counting of said time period.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 1, 2013
    Applicants: STMICROELECTRONICS S.R.L., DORA S.P.A.
    Inventors: DORA S.P.A., STMicroelectronics S.r.l.
  • Publication number: 20130187681
    Abstract: A switching circuit includes a first input stage having an input for receiving a first input signal, an output, and a power terminal for receiving an increasing analog current, a second input stage having an input for receiving a second input signal, an output, and a power terminal for receiving a decreasing analog current, and an output node coupled to the outputs of the first input stage and the second input stage for providing a switched output signal. An output stage is coupled between the first and second input stages and the output node. The first and second input stages are operational amplifiers.
    Type: Application
    Filed: December 3, 2012
    Publication date: July 25, 2013
    Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD.
    Inventor: STMicroelectronics (Shenzhen) R&D CO., LTD.
  • Publication number: 20130186446
    Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Applicant: STMICROELECTRONICS, INC.
    Inventor: STMicroelectronics, Inc.
  • Publication number: 20130188522
    Abstract: The addition of high throughput capability elements to beacon frames and peer link action frames in wireless mesh networks enable the utilization of desirable features without further modifications to the network. Rules can be established for high throughput mesh point protection in a mesh network, Space-time Block Code (STBC) operations and 20/40 MHz operation selections. However, features such as PSMP (power save multi-poll) and PCO (phased coexistence operations) are barred from implementation to prevent collisions.
    Type: Application
    Filed: January 11, 2013
    Publication date: July 25, 2013
    Applicants: STMICROELECTRONICS SRL
    Inventors: STMicroelectronics, Inc., STMicroelectronics Srl
  • Publication number: 20130188793
    Abstract: A method of operating a speaker system including a speaker coupled to an amplifier, and a dedicated digital speaker protection circuit includes turning on the amplifier in a mute mode, after a first delay period, issuing a play command to the amplifier to place the amplifier in a play mode, but without an input signal during a second delay period, and performing a speaker offset detection during the second delay period, wherein, if there is an offset, then the amplifier is forced back into the mute mode, and if there is no offset, then the amplifier is allowed to continue to operate in the play mode. The method also includes issuing a speaker protection control signal or command if an offset is detected.
    Type: Application
    Filed: December 3, 2012
    Publication date: July 25, 2013
    Applicants: STMICROELECTRONICS, S.R.L., STMICROELECTRONICS (SHENZHEN) R&D CO. LTD.
    Inventors: STMicroelectronics (Shenzhen) R&D CO. LTD., STMicroelectronics, S.r.l.