Patents by Inventor Story Huang
Story Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6896762Abstract: The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membraType: GrantFiled: December 18, 2002Date of Patent: May 24, 2005Assignee: Industrial Technology Research InstituteInventors: Story Huang, Jia-Bin Hsu, Chun-Hsien Liu, Chia-Hung Hung
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Patent number: 6843879Abstract: The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membraType: GrantFiled: June 16, 2004Date of Patent: January 18, 2005Assignee: Industrial Technology Research InstituteInventors: Story Huang, Jia-Bin Hsu, Chun-Hsien Liu, Chia-Hung Hung
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Publication number: 20050000648Abstract: The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membraType: ApplicationFiled: June 16, 2004Publication date: January 6, 2005Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Story Huang, Jia-Bin Hsu, Chun-Hsien Liu, Chia-Hung Hung
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Publication number: 20040118515Abstract: The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membraType: ApplicationFiled: December 18, 2002Publication date: June 24, 2004Applicant: Industrial Technology Research InstituteInventors: Story Huang, Jia-Bin Hsu, Chun-Hsien Liu, Chia-Hung Hung
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Publication number: 20030218390Abstract: A voice-coil motor for picking up chips is disclosed. Through the electromagnetic force generated from the voice-coil motor, the invention can accurately control its strength when picking up a chip. The procedure of picking a chip is as follows: first, a chip is separated from a blue film due to the force of a rising ejectpin; then a pickup head is used to suck the chip to an assigned place. In particular, when the ejectpin pushes the chip up, the pickup head is controlled to rise together with the ejectpin so that the ejectpin also raises the pickup head. Through the above-mentioned control, the stress on the chip can be reduced, preventing the chip from being broken.Type: ApplicationFiled: May 22, 2002Publication date: November 27, 2003Inventors: Story Huang, Chun-Hsien Liu, Szu-Hui Lee, Yvonne Chang, Hung-I Lin, Jia-Bin Hsu
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Patent number: 6651865Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.Type: GrantFiled: July 3, 2002Date of Patent: November 25, 2003Assignee: Industrial Technology Research InstituteInventors: Story Huang, Szu-Hui Lee, Yvonne Chang, Hung-I Lin, Jia-Bin Hsu, Chun-Hsien Liu
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Publication number: 20030197048Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.Type: ApplicationFiled: July 3, 2002Publication date: October 23, 2003Inventors: Story Huang, Szu-Hui Lee, Yvonne Chang, Hung-I Lin, Jia-Bin Hsu, Chun-Hsien Liu
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Patent number: 6220420Abstract: A semiconductor composition material conveyer module, which includes at least one horizontal conveyer unit and at least one vertical conveyer unit arranged with the at least one horizontal conveyer unit to form an automatic production line for conveying semiconductor composition material for processing. A displacement sensor is triggered when semiconductor composition material is delivered from the horizontal conveyer unit at one production line to the matched vertical conveyer unit, thereby causing the matched vertical conveyer unit to carry semiconductor composition material to a horizontal conveyer unit at a second production line for further processing.Type: GrantFiled: March 30, 1999Date of Patent: April 24, 2001Assignees: Industrial Technology Research Institute, Gallant Precision Machining Co., Ltd.Inventors: Chalson Jan, Story Huang, Shin-Hsiung Lee