Abstract: There is disclosed an improved apparatus for manufacturing printed circuit boards which solves the problem of immersion bath contaminants being plated-out onto electrically-conductive, circuit functional pads, (board-features) by introducing into the bath system a mechanism for attracting those contaminants to non-functional “micro-thieves” which are electrically-conductive, non-circuit-functional pads having substantially smaller dimensions than those of the smallest board-feature, thereby taking advantage of previously unknown immersion bath uncontrolled strike phenomena, whereby the contaminants are directed to the micro-thieves and away from the board-features. Application of the micro-thieves in the immersion bath environment also produces plated features, of both finer and larger geometries, having flatter surfaces and a more uniform plated thickness for all features on the printed circuit board (PCB), than previously obtained.

Abstract: There is disclosed an improved method for manufacturing printed circuit boards which solves the problem of immersion bath contaminants being plated-out onto electrically-conductive, circuit functional pads, (board-features) by introducing into the bath system a mechanism for attracting those contaminants to non-functional “micro-thieves” which are electrically-conductive, non-circuit-functional pads having substantially smaller dimensions than those of the smallest board-feature, thereby taking advantage of previously unknown immersion bath uncontrolled strike phenomena, whereby the contaminants are directed to the micro-thieves and away from the board-features. Application of the micro-thieves in the immersion bath environment also produces plated features, of both finer and larger geometries, having flatter surfaces and a more uniform plated thickness for all features on the printed circuit board, than previously obtained.