Abstract: A semiconductor interconnect structure which includes a semiconductor substrate having a bottom surface. The printed circuit board also has a plurality of solder wettable pads disposed on the top surface of the printed circuit board. The printed circuit board and the semiconductor substrate are both comprised of material taken from the same group of materials. The interconnect structure also includes a plurality of balls formed of a first solder alloy disposed on the bottom surface of the semiconductor substrate and projecting downwardly therefrom. Each one of the plurality of balls are sized to support the weight of the semiconductor substrate. The interconnect structure also includes a plurality of solder joints formed of a second solder alloy connecting the plurality of balls to the corresponding plurality of wettable pads on the printed circuit board.