Patents by Inventor Stuart Hellring

Stuart Hellring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230096905
    Abstract: The present invention is directed to a lithium ion battery electrode slurry composition comprising: (a) an electrochemically active material capable of lithium intercalation and deintercalation; (b) a binder dispersed in an aqueous or organic medium and comprising a reaction product of a reaction mixture comprising one or more epoxy functional polymer(s) and one or more acid functional acrylic polymer(s); and (c) an electrically conductive agent. The present invention also provides an electrode comprising: (a) an electrical current collector; and (b) a cured film formed on the electrical current collector. The cured film is deposited from the slurry composition described above. Electrical storage devices prepared from the electrode are also provided.
    Type: Application
    Filed: June 20, 2022
    Publication date: March 30, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Randy E. Daughenbaugh, Shanti Swarup, Stuart Hellring, Anthony Chasser
  • Patent number: 11374223
    Abstract: The present invention is directed to a lithium ion battery electrode slurry composition comprising: (a) an electrochemically active material capable of lithium intercalation and deintercalation; (b) a binder dispersed in an aqueous or organic medium and comprising a reaction product of a reaction mixture comprising one or more epoxy functional polymer(s) and one or more acid functional acrylic polymer(s); and (c) an electrically conductive agent. The present invention also provides an electrode comprising: (a) an electrical current collector; and (b) a cured film formed on the electrical current collector. The cured film is deposited from the slurry composition described above. Electrical storage devices prepared from the electrode are also provided.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 28, 2022
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Randy E. Daughenbaugh, Shanti Swarup, Stuart Hellring, Anthony Chasser
  • Patent number: 8728217
    Abstract: In some embodiments, the present invention provide filtration media for the treatment of flue gas streams and methods of making and using the same. In one embodiment, a filtration medium comprises a pollutant absorbent layer comprising a plurality of activated carbon fibers, at least one woven fabric, and at least one non-woven fabric, wherein the pollutant absorbent layer is positioned between the at least one woven fabric and the at least one non-woven fabric.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: May 20, 2014
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Vedagiri Velpari, Jian Meng, Dennis Gilmore, Timothy E. Marsh, James Watson, Stuart Hellring, Paul A. Westbrook
  • Publication number: 20120017763
    Abstract: In some embodiments, the present invention provide filtration media for the treatment of flue gas streams and methods of making and using the same. In one embodiment, a filtration medium comprises a pollutant absorbent layer comprising a plurality of activated carbon fibers, at least one woven fabric, and at least one non-woven fabric, wherein the pollutant absorbent layer is positioned between the at least one woven fabric and the at least one non-woven fabric.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 26, 2012
    Inventors: Vedagiri Velpari, Jian Meng, Dennis Gilmore, Timothy E. Marsh, James Watson, Stuart Hellring, Paul A. Westbrook
  • Publication number: 20080090500
    Abstract: This invention is directed to a slurry system and process of metal removal from a substrate. This invention is useful for polishing a microelectronic device. This invention is especially useful for chemical mechanical planarization of a semiconductor wafer for removal of an overburden thereof. The slurry system of the present invention includes a first slurry and a second slurry, wherein the first slurry has a higher abrasive concentration than the second slurry. The process of the present invention includes a first polish with the first slurry to partially remove metal from the substrate, and a second polish with the second slurry to further remove metal from the substrate.
    Type: Application
    Filed: April 16, 2007
    Publication date: April 17, 2008
    Applicant: PPG INDUSTRIES OHIO, INC.
    Inventors: Stuart Hellring, Yuzhuo Li, Robert Auger
  • Publication number: 20080034670
    Abstract: A method of CMP of a substrate surface includes providing a polishing pad having a polishing layer, that may be substantially free of abrasive particles, with a functional group chemically bonded (covalent or ionic) to the polishing layer. The functional group acts as an activator or catalyst for a compound of a polishing slurry to exhibit a higher material removal rate for removing selected portions of the surface of the substrate than exhibited in CMP of a substantially identical substrate in the presence of a substantially identical polishing slurry and a polishing pad wherein the substantially identical polishing layer does not have the functional group. The functional group may be derived from a compound comprising a polyamine, a polyelectrolyte, and/or an amino acid. A method of making the CMP pad and the CMP pad formed thereby is also disclosed.
    Type: Application
    Filed: August 20, 2007
    Publication date: February 14, 2008
    Applicant: PPG INDUSTRIES OHIO, INC.
    Inventors: Yuzhuo Li, Stuart Hellring, Jason Keleher, Tianxi Zhang
  • Publication number: 20070037491
    Abstract: A method of CMP of a substrate surface includes providing a polishing pad having a polishing layer, that may be substantially free of abrasive particles, with a functional group chemically bonded (covalent or ionic) to the polishing layer. The functional group acts as an activator or catalyst for a compound of a polishing slurry to exhibit a higher material removal rate for removing selected portions of the surface of the substrate than exhibited in CMP of a substantially identical substrate in the presence of a substantially identical polishing slurry and a polishing pad wherein the substantially identical polishing layer does not have the functional group. The functional group may be derived from a compound comprising a polyamine, a polyelectrolyte, and/or an amino acid. A method of making the CMP pad and the CMP pad formed thereby is also disclosed.
    Type: Application
    Filed: August 12, 2005
    Publication date: February 15, 2007
    Inventors: Yuzhuo Li, Stuart Hellring, Jason Keleher, Tianxi Zhang
  • Publication number: 20060084746
    Abstract: Described are hydrophobic particulate inorganic oxides useful for reinforcing polymeric composition, e.g., rubber. The materials are characterized by: (a) the substantial absence of functional groups capable of chemical reaction with rubber; (b) a BET surface area of in the range of from 40 to 350 m2/g; (c) a hydroxyl content in the range of 2 to 15 OH/nm2; (d) a carbon content in the range of from 0.1 to 6 percent by weight that is substantially non-extractable; (e) a pH in the range of from 3 to 10; (f) an M1 Standard White Area less than 0.4 percent and (g) a methanol wettability of from 15 to 45 percent. Compositions such as polymers, cured organic rubber articles, master batches and slurries containing the hydrophobic fillers are also described.
    Type: Application
    Filed: December 2, 2005
    Publication date: April 20, 2006
    Inventors: Jo-Ann Bice, Stuart Hellring, Timothy Okel