Patents by Inventor Stuart Lichtenthal

Stuart Lichtenthal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced reliability for semiconductor devices using dielectric encasement
    Patent number: 8058163
    Abstract: A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: November 15, 2011
    Assignee: Flipchip International, LLC
    Inventors: John J. H. Reche, Michael E. Johnson, Guy F. Burgess, Anthony P. Curtis, Stuart Lichtenthal
  • ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENCASEMENT
    Publication number: 20100032836
    Abstract: A method and device for enhanced reliability for semiconductor devices using dielectric encasement is disclosed. The method and device are directed to improving the reliability of the solder joint that connects the integrated circuit (IC) chip to the substrate. The method comprises applying a layer of a photoimageable permanent dielectric material to a top surface of the semiconductor device, and patterning the layer of the photoimageable permanent dielectric material to have an opening over each feature. The method further comprises dispensing or stencil printing fluxing material into the permanent dielectric material openings, and applying solder, which contains no flux, to a top surface of the fluxing material. In one or more embodiments, the method further comprises heating the semiconductor device to a reflow temperature appropriate for the reflow of the solder, thereby causing the solder to conform to sidewalls of the permanent dielectric material openings to form a protective seal.
    Type: Application
    Filed: August 6, 2009
    Publication date: February 11, 2010
    Applicant: FLIPCHIP INTERNATIONAL, LLC
    Inventors: John J.H. Reche, Michael E. Johnson, Guy F. Burgess, Anthony P. Curtis, Stuart Lichtenthal