Abstract: A densely packed array of vertical semiconductor devices, having pillars with stack capacitors thereon, and methods of making thereof are disclosed. The pillars act as transistor channels, and are formed between upper and lower doped regions. The lower doped regions are self-aligned and are located below the pillars. The array has columns of bitlines and rows of wordlines. The lower doped regions of adjacent bitlines may be isolated from each other without increasing the cell size and allowing a minimum area of approximately 4 F.sup.2 to be maintained. The array is suitable for Gbit DRAM applications because the stack capacitors do not increase array area. The array may have an open bitline, a folded, or an open/folded architecture with dual wordlines, where two transistors are formed on top of each other in each trench. The lower regions may be initially implanted. Alternatively, the lower regions may be diffused below the pillars after forming thereof.

Abstract: A densely packed array of vertical semiconductor devices having pillars and methods of making thereof are disclosed. The array has columns of bitlines and rows of wordlines. The gates of the transistors act as the wordlines, while the source or drain regions acts as the bitlines. The array also has vertical pillars, each having a channel formed between source and drain regions. Two transistors are formed per pillar. This is achieved by forming two gates per pillar formed on opposite pillar sidewalls which are along the bitline direction. This forms two wordlines or gates per pillar arranged in the wordline direction. The source regions are self-aligned and located below the pillars. The source regions of adjacent bit lines are isolated from each other without increasing the cell size.

Abstract: A densely packed array of vertical semiconductor devices, having pillars and deep trench capacitors, and methods of making thereof are disclosed. The pillars act as transistor channels, and are formed between upper and lower doped regions. The lower doped regions are self-aligned and are located below the pillars. The array has columns of bitlines and rows of wordlines. The lower doped regions of all the cells are isolated from each other without increasing the cell size and allowing a minimum area of approximately 4F.sup.2 to be maintained. The array is suitable for Gbit DRAM applications because the deep trench capacitors do not increase array area. The array may have an open bitline, a folded, or an open/folded architecture with dual wordlines, where two transistors are formed on top of each other in each trench. The lower regions may be initially implanted. Alternatively, the lower regions may be diffused below the pillars after forming thereof.

Abstract: A densely packed array of vertical semiconductor devices and methods of making thereof are disclosed. The array has columns of bitlines and rows of wordlines. The gates of the transistors act as the wordlines, while the source or drain regions acts as the bitlines. The array also has vertical pillars, acting as a channel, formed between source and drain regions. The source regions are self-aligned and located below the pillars. The source regions of adjacent bitlines are isolated from each other without increasing the cell size and allowing a minimum area of approximately 4F.sup.2 to be maintained. The isolated sources allow individual cells to be addressed and written via direct tunneling, in both volatile and non-volatile memory cell configurations. The source may be initially implanted. Alternatively, the source may be diffused below the pillars after forming thereof.

Abstract: A densely packed array of vertical semiconductor devices, having pillars and deep trench capacitors, and methods of making thereof are disclosed. The pillars act as transistor channels, and are formed between upper and lower doped regions. The lower doped regions are self-aligned and are located below the pillars. The array has columns of bitlines and rows of wordlines. The lower doped regions of all the cells are isolated from each other without increasing the cell size and allowing a minimum area of approximately 4F.sup.2 to be maintained The array is suitable for Gbit DRAM applications because the deep trench capacitors do not increase array area. The array may have an open bitline, a folded, or an open/folded architecture with dual wordlines, where two transistors are formed on top of each other in each trench. The lower regions may be initially implanted. Alternatively, the lower regions may be diffused below the pillars after forming thereof.

Abstract: A densely packed array of vertical semiconductor devices having pillars and methods of making thereof are disclosed. The array has columns of bitlines and rows of wordlines. The gates of the transistors act as the wordlines, while the source or drain regions acts as the bitlines. The array also has vertical pillars, each having a channel formed between source and drain regions. Two transistors are formed per pillar. This is achieved by forming two gates per pillar formed on opposite pillar sidewalls which are along the bitline direction. This forms two wordlines or gates per pillar arranged in the wordline direction. The source regions are self-aligned and located below the pillars. The source regions of adjacent bit lines are isolated from each other without increasing the cell size. Two floating gates per pillar may be used for EEPROM or flash memory application.

Abstract: A densely packed array of vertical semiconductor devices, having pillars with stack capacitors thereon, and methods of making thereof are disclosed. The pillars act as transistor channels, and are formed between upper and lower doped regions. The lower doped regions are self-aligned and are located below the pillars. The array has columns of bitlines and rows of wordlines. The lower doped regions of adjacent bitlines may be isolated from each other without increasing the cell size and allowing a minimum area of approximately 4F.sup.2 to be maintained. The array is suitable for Gbit DRAM applications because the stack capacitors do not increase array area. The array may have an open bitline, a folded, or an open/folded architecture with dual wordlines, where two transistors are formed on top of each other in each trench. The lower regions may be initially implanted. Alternatively, the lower regions may be diffused below the pillars after forming thereof.

Abstract: A densely packed array of vertical semiconductor devices and methods of making thereof are disclosed. The array has columns of bitlines and rows of wordlines. The gates of the transistors act as the wordlines, while the source or drain regions acts as the bitlines. The array also has vertical pillars, acting as a channel, formed between source and drain regions. The source regions are self-aligned and located below the pillars. The source regions of adjacent bitlines are isolated from each other without increasing the cell size and allowing a minimum area of approximately 4F.sup.2 to be maintained. The isolated sources allow individual cells to be addressed and written via direct tunneling, in both volatile and non-volatile memory cell configurations. The source may be initially implanted. Alternatively, the source may be diffused below the pillars after forming thereof.

Abstract: Method for creating a doped polysilicon layer of accurate shape on a sidewall of a semiconductor structure. According to the present method, a doped polysilicon film covering at least part of said semiconductor structure and of said sidewall is formed. This polysilicon film then undergoes a reactive ion etching (RIE) process providing for a high etch rate of said polysilicon film to approximately define the shape of the polysilicon layer on said sidewall. Then, said polysilicon film undergoes a second reactive ion etching process. This second reactive ion etching process is a low polysilicon etch rate process such that non-uniformities of the surface of said polysilicon film are removed by sputtering.